Disassembly device and method for disassembling printed circuit board on liquid crystal display module

A technology for liquid crystal display modules and printed circuit boards, which is used in printed circuits, printed circuit manufacturing, and printed circuit secondary processing. High efficiency, good dismantling effect, and non-destructive dismantling effect

Active Publication Date: 2017-07-11
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1) All removed FPC/COF are scrapped;
[0008] 2) Manual removal of ACF residual glue is likely to cause electrode

Method used

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  • Disassembly device and method for disassembling printed circuit board on liquid crystal display module
  • Disassembly device and method for disassembling printed circuit board on liquid crystal display module
  • Disassembly device and method for disassembling printed circuit board on liquid crystal display module

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Embodiment Construction

[0044] Embodiments of the invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present invention, but should not be construed as limitations to the present invention. Those of ordinary skill in the art can There are numerous changes, modifications, substitutions and variations to these embodiments, the scope of the present invention being defined by the claims and their equivalents.

[0045] In describing the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom" " The orientation or positional relationship indicated by "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present inventi...

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PUM

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Abstract

The invention discloses a disassembly device and method for disassembling printed circuit board on a liquid crystal display module, and the device comprises a pedestal; a carrying platform assembly which is disposed on the pedestal and comprises a first carrying platform for carrying the liquid crystal display module, and a second carrying platform for carrying the printed circuit board, wherein the first carrying platform can move relative to the second carrying platform, the first carrying platform is provided with a fixed part and the second carrying platform is provided with a second fixed part; a hot pressing mechanism which is disposed on the pedestal, and is provided with at least one hot pressing head and a heating part for heating the hot pressing head, wherein the hot pressing head can move up and down relative to the pedestal, so as to achieve the pressing and heating of a bonding electrode part of the printed circuit board; a supply mechanism for providing a silica gel band, wherein the supply mechanism is connected with the pedestal and the silica gel band stretches between the hot pressing head and the bonding electrode part. According to the embodiment of the invention, the device can achieve the disassembly of the printed circuit board through hot pressing and horizontal pulling, is good in disassembly effect, can reduce the rejection rate and saves time and labor.

Description

technical field [0001] The present invention relates to the technical field of electronic devices, more specifically, to a dismantling device and method for dismantling a printed circuit board from a liquid crystal display module, especially applicable to dismantling defective PCBA in a liquid crystal display module. Background technique [0002] In the production of liquid crystal display modules, the first step of replacing PCBA (Printed Circuit Board+Assembly, also known as assembly printed circuit board) is to disassemble the defective PCBA. The specific operation steps are as follows: [0003] Step 1: Manually use a heat gun to heat the electrodes connected to each FPC / COF and PANEL bonding separately and tear them apart; [0004] Step 2: Manually remove the ACF residue on the PANEL electrode; [0005] Step 3: Re-bond the new FPC / COF and PCBA. [0006] The above operation will cause the following problems: [0007] 1) All removed FPC / COF are scrapped; [0008] 2) Ma...

Claims

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Application Information

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IPC IPC(8): H05K3/22G02F1/13
CPCG02F1/1303H05K3/225H05K2203/176
Inventor 蔡光源
Owner BOE TECH GRP CO LTD
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