An integrated electronic device and its production method

Abstract

The application discloses an integrated electronic device, including: a base plate, an active device, a passive device, a molding compound and a conducting member; the active device is arranged on the base board; the molding compound covers the active device and On the base plate covered by the active device; the passive device is arranged on the molding compound; the conducting member penetrates the molding compound, and conductively connects the active device covered by the molding compound with the Passive components above the molding compound. The embodiment of the present application also provides a corresponding production method. The technical solution of this application implements the stacking of active devices and passive devices on the same plane, which not only reduces the flat layer area of ​​the integrated electronic device, improves the power density of the integrated electronic device, but also directly connects the upper and lower parts of the integrated electronic device through the conductive member. The active and passive devices on the first layer also shorten the conduction path to facilitate current flow, and there is no need to set up a shelf for placing passive devices, which is not only simple to process, but also convenient to fill with plastic molding compound.

Description

technical field [0001] The present application relates to the field of electronic technology, in particular to an integrated electronic device and a production method thereof. Background technique [0002] Electronic products are usually integrated with active devices and passive devices, and the active devices and passive devices are connected through a circuit. Active devices are devices that require power supply to work normally, and passive devices are devices that can work normally without additional power supply in the circuit. Electronic products can be products that require volume and power density, such as optical modules, mobile phones, wearable devices, and communication power supplies. Taking communication power supplies as an example, Power Supply InPackage (PSIP) modules include integrated circuits (Integrated Circuit, IC ), Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) and other active devices, as well as passive devices such as inductors and cap...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems in the prior art that the floor area of ​​electronic products is too large due to tiled layout, the processing of overhead layout is complicated, and the filling is difficult, the embodiment of the present application provides an integrated electronic device that arranges passive devices and active devices on the The upper and lower layers, the passive device and the active device are separated by the molding compound, and the passive device and the active device of the upper and lower layers are connected through the connector, which not only reduces the flat layer area of ​​the integrated electronic device, but also makes the processing simple. Easy to fill

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