Packaging structure and an organic light emitting display device

A packaging structure and display device technology, which is applied in the direction of organic semiconductor devices, electrical components, electric solid devices, etc., can solve the problems of shortening device life, cracks, infiltration, etc., and achieve the effects of improving packaging effects, repairing cracks, and improving quality

Pending Publication Date: 2017-11-21
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the process of OLED preparation, due to mechanical stress or thermal stress, cracks will appear inside the material and at the interface between materials. Even if the water and oxygen barrier layer has good water and oxygen barrier properties, there will still be cracks at the cracks. Infiltration of moisture and oxygen shortens device life

Method used

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  • Packaging structure and an organic light emitting display device
  • Packaging structure and an organic light emitting display device
  • Packaging structure and an organic light emitting display device

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Embodiment Construction

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of patent protection of the present invention.

[0048] like figure 1 As shown, the present invention provides a packaging structure for packaging a display device. The packaging structure includes a self-healing functional layer 2, a heating layer 1 for heating the self-healing functional layer 2, and a material for forming the self-healing functional layer 2 Include at least: self-healing material22.

[0049] The packaging structure provided by the present invention can repair the cracked packag...

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Abstract

The invention relates to the technical field of display, and discloses a packaging structure and an organic light emitting display device which are used to repair cracks generated in a packaging layer, improve the packaging effect and improve the quality of the organic light emitting display device. The packaging structure includes a self-repairing functional layer and a heating layer for heating the self-repairing functional layer. The self-repairing functional layer at least includes a self-repairing material.

Description

technical field [0001] The invention relates to the field of display technology, and discloses a packaging structure and an organic light-emitting display device. Background technique [0002] Compared with traditional liquid crystal displays, organic light emitting devices (organic light emitting devices, OLEDs) have the advantages of active light emission, fast response, large viewing angle, and bendability. In recent years, with the maturity and development of organic electroluminescent technology, related display products have been put into the market. However, since organic materials and metals are very sensitive to moisture and oxygen, the device needs to be packaged and protected after fabrication to prevent the reduction of device life caused by water and oxygen corrosion. Therefore, the packaging process plays a very important role in maintaining the overall luminous performance of the device. [0003] The traditional OLED packaging method is to prepare one or mor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52
CPCH10K50/844H10K50/87H10K71/861
Inventor 于晶陈右儒
Owner BOE TECH GRP CO LTD
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