Special radiator fan structure for microelectronic equipment

A heat dissipation fan and heat dissipation fan technology, applied to mechanical equipment, parts of pumping devices for elastic fluids, non-variable pumps, etc., can solve the problems of complex installation, easy to burn equipment, large volume, etc., and achieve faster The efficiency of heat dissipation, effective and uniform heat transfer, and the effect of increasing the heat dissipation area
CN107620718AActive Publication Date: 2018-01-23ANHUI UNIVERSITY OF TECHNOLOGY AND SCIENCE
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
ANHUI UNIVERSITY OF TECHNOLOGY AND SCIENCE
Publication Date
2018-01-23

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Abstract

The invention discloses a special radiator fan structure for microelectronic equipment. The special radiator fan structure comprises a bottom connecting plate, a fan, a first radiator fan and a secondradiator fan, wherein the bottom connecting plate is mounted at the bottom of the first radiator fan; the first radiator fan and the second radiator fan are fixedly connected together; a flow exchange gap is formed at the joint of the first radiator fan and the second radiator fan; the fan is mounted at the top of the second radiator fan; a conduction ring is arranged in the middle of each of thefirst radiator fan and the second radiator fan; each conduction ring sleeves an inner connecting ring; radiation pieces are uniformly arranged on the surface of each inner connecting ring and embedded into rectangular grooves of the corresponding conduction ring; an impeller is mounted in the middle of the interior of each conduction ring; the impellers are driven by a rotating shaft to rotate; adriving motor is connected to the top of the rotating shaft; the rotating shaft penetrates the driving motor and is connected with fan blades; and the driving motor and the fan blades are arranged inthe fan. Owing to the multi-layer fan structure, multi-stage progressive air intake and exhaust in the structure are realized; and meanwhile, the heat dissipation area is increased through arc-shapedfins, and the heat dissipation efficiency is improved.
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Description

technical field

[0001] The invention relates to the technical field of microelectronic equipment, in particular to a cooling fan structure dedicated to microelectronic equipment. Background technique

[0002] Microelectronics technology is a new technology developed along with integrated circuits, especially VLSIs. The theoretical basis of its development is modern physics established from the end of the 19th century to the 1930s. Microelectronics technology includes a series of specialized technologies such as system circuit design, device physics, process technology, material preparation, automatic testing, packaging, and assembly. , Microelectronics technology is the sum of various process technologies in microelectronics. Due to the small size and high power operation of microelectronic equipment, it generates very high heat, and excessive heat will easily reduce the operating efficiency of microelectronic equipment such as chips. , At the same time, it is easy to burn ...

Claims

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