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Double-sided adhesive tape, electronic instrument propided with said double-sided adhesive tape, disassembly structure provided with said double-sided adhesive tape, and adhered structure

An electronic device, double-sided technology, applied to double-sided adhesive tape, can solve the problem that the internal power supply cannot be recycled

Pending Publication Date: 2018-03-23
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that such an internal power supply cannot be recycled

Method used

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  • Double-sided adhesive tape, electronic instrument propided with said double-sided adhesive tape, disassembly structure provided with said double-sided adhesive tape, and adhered structure
  • Double-sided adhesive tape, electronic instrument propided with said double-sided adhesive tape, disassembly structure provided with said double-sided adhesive tape, and adhered structure
  • Double-sided adhesive tape, electronic instrument propided with said double-sided adhesive tape, disassembly structure provided with said double-sided adhesive tape, and adhered structure

Examples

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Effect test

Embodiment Construction

[0045] Referring to the drawings, preferred embodiments for carrying out the present invention will be described below. It should be noted that the following embodiments illustrate examples of representative embodiments of the invention and should not be construed as limiting the scope of the invention. Instructions will be given in the following order.

[0046] 1. Double-sided pressure-sensitive adhesive tape 1

[0047] (1) Pressure sensitive layer 11

[0048] (2) Thermal foaming agent 13

[0049] (3) Conductive heating layer 12

[0050] (4) adherend

[0051] 2. Electronics 101

[0052] (1) Internal power supply 102

[0053] (2) adherend 103

[0054] (3) Double-sided pressure-sensitive adhesive tape 104

[0055] (4) Drive circuit 105

[0056] (5) Switching element 106

[0057] (6) Evaluation of double-sided pressure-sensitive adhesive tape

[0058] 3. Detachable structure

[0059] 4. Adhesive structure

[0060](1) First adherend 201 and second adherend 202

[00...

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PUM

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Abstract

Provided is an adhesion technique for delaminating a material of interest while satisfying the requirements for the reliability assurance temperature for the material, with a view to reproduce the material. A double-sided adhesive tape comprising a pair of adhesive layers and an electrically conductive heat-generating layer arranged between the pair of adhesive layers, wherein at least one of thepair of adhesive layers contains a thermal foaming agent, and the end face of the electrically conductive heat-generating layer projects from the end face of at least one of the adhesive layers.

Description

technical field [0001] The present invention relates to a technique of adhering a plurality of adherends to each other and separating them from each other. Background technique [0002] As a pressure-sensitive adhesive tape for bonding a plurality of adherends to each other, the pressure-sensitive adhesive tape disclosed in PTL 1 has been known for many years. The pressure-sensitive adhesive tape disclosed in PTL 1 is structured to include at least one pressure-sensitive adhesive layer containing a thermal blowing agent, so that when the pressure-sensitive adhesive layer is heated so that the blowing agent foams, the pressure-sensitive adhesive The joint tape is separated from each individual adherend. [0003] Such a pressure-sensitive adhesive tape is used, for example, in electronic equipment such as a personal computer or a mobile phone, for adhering an internal power supply, such as a battery for the electronic equipment, to a case in which the internal power supply is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/38B32B5/20C08J9/32C09J5/06C09J201/00C09J7/20C09J7/30
CPCC09J5/06C09J7/20C08K3/08C08K9/10C09J2203/326C09J2400/163C09J7/30C09J2301/204C09J2301/124C09J2301/412C09J2301/408C09J2301/41C09J2301/502C09J2301/302Y02E60/10B32B5/20C09J201/00C09J7/38C09J9/02H05K1/181H05K2201/10037H05K2201/10053
Inventor 三星正彦
Owner SONY CORP
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