Water-cooled radiator and heat-dissipating system

A technology of water-cooling and radiator, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of poor heat dissipation effect of radiators, achieve accurate and reliable experimental results, stable heat process, and accelerated The effect of a large contact area

Pending Publication Date: 2018-04-13
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] One of the objects of the present invention is to provide a water-cooled radiator, which aims to solve the problem of poor heat dissipation effect of radiators in the prior ar

Method used

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  • Water-cooled radiator and heat-dissipating system
  • Water-cooled radiator and heat-dissipating system
  • Water-cooled radiator and heat-dissipating system

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0035] Example one:

[0036] Please refer to figure 1 , With reference Figure 2 to Figure 3 This embodiment provides a heat dissipation system, which includes a water-cooled radiator 1, which is mainly used for heat dissipation of high-power products.

[0037] Further, the water-cooled radiator 1 includes a heat dissipation plate 2 having opposite first and second side ends, wherein the first side end is provided with a water inlet 3, and the second side end is provided with an outlet The nozzle 4, the water inlet 3 and the water outlet 4 have the same structure and they are on the same straight line. At the same time, the heat dissipation plate 2 is provided with a fluid channel 5, which extends from the water inlet 3 to the water outlet 4. The fluid channel 5 has a first inner wall and a second inner wall opposite to each other, on the first inner wall and the second inner wall. A plurality of spacers 6 distributed at intervals are respectively provided, and the axial directio...

Example Embodiment

[0043] Embodiment two:

[0044] Please refer to Figure 4 with Figure 5 , With reference figure 1 The structure of the water-cooled radiator 1 in this embodiment is substantially the same as that in the first embodiment, and the difference is that the structure of the barrier 6 is different from that in the first embodiment.

[0045] In this embodiment, the baffle 6 has a plate-like structure on which a transverse agitator 12 is arranged, wherein the transverse agitator 12 includes a hydraulic cylinder 13, a connecting shaft 14, and a mixing head 15. The hydraulic cylinder 13 Installed inside the baffle 6, one end of the connecting shaft 14 is connected to the output shaft of the hydraulic cylinder 13, and the other end passes through the baffle plate and is connected to the stirring head 15. When the hydraulic cylinder 13 is activated, the hydraulic cylinder 13 can drive The stirring head 15 reciprocates along the axial direction of the baffle 6.

[0046] Specifically, the stirrin...

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PUM

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Abstract

The invention provides a water-cooled radiator and a heat-dissipating system and belongs to the technical field of radiators. The water-cooled radiator includes a heat-dissipating plate. A water inletand a water outlet are disposed on the opposite side ends of the heat-dissipating plate respectively. The heat-dissipating plate is provided with a fluid channel. The fluid channel extends from the water inlet to the water outlet, and is provided therein with multiple stoppers distributed at intervals. The axial direction of the stoppers and the axial direction of the heat-dissipating plate are angled. The heat-dissipating system has the water-cooled radiator, is simple in structure, and easy to use, and has a good heat dissipation effect.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a water-cooled radiator and a heat dissipation system. Background technique [0002] With the continuous development of electronic technology, the integration of electronic products is getting higher and higher, the frequency is getting faster and the power is getting bigger and bigger. The continuous introduction of high-power electronic components and equipment makes the demand for heat sinks with high efficiency and high performance increasingly urgent. [0003] At present, known radiators, some use fans to dissipate heat, and some use copper-aluminum media to conduct heat and dissipate heat. There are also liquid circulation radiators and heat pipe radiators (the inside of the heat pipe mainly utilizes the vapor and liquid phase change heat transfer of the liquid). But they all have their own deficiencies, such as poor heat transfer, noise, breakage or demanding operating ...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/473
CPCH01L23/3672H01L23/473
Inventor 罗国兴韩玉成胡志亮冷俊龙辉
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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