Aqueous adhesive composition comprising thermosetting resin

A technology for water-based adhesives and compositions, applied in the directions of polyether adhesives, adhesive types, surface pretreatment bonding methods, etc., which can solve the problems of vigorous stirring and increased duration of equipment

Pending Publication Date: 2019-02-05
MICHELIN & CO CIE GEN DES ESTAB MICHELIN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, the phenol / formaldehyde resins described therein are sparingly water soluble and require particularly vigorous agitation during their addition to aqueous compositions
This vigorous stirring requires expensive equipment and increases the duration of the process

Method used

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  • Aqueous adhesive composition comprising thermosetting resin
  • Aqueous adhesive composition comprising thermosetting resin
  • Aqueous adhesive composition comprising thermosetting resin

Examples

Experimental program
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Embodiment Construction

[0025] I - Formulation of Waterborne Adhesive Compositions

[0026] In this specification, all percentages (%) shown are % by weight unless otherwise expressly stated.

[0027] "Meta relative to each other" is intended to mean that the functional groups in question (such as the hydroxyl functionality in aromatic polyphenols) are carried by carbons of the aromatic ring that are separated from each other by a single other carbon of the aromatic ring.

[0028] "Para with respect to each other" is intended to mean that the functional groups in question are opposite each other, ie at position 1 and position 4 of the 6-membered aromatic ring. Similarly, "para" to a functional group is the position relative to the functional group on the 6-membered aromatic ring bearing the functional group.

[0029] "Ortho to a functional group" is intended to mean the position occupied by a carbon of an aromatic ring next to a carbon of the aromatic ring bearing the functional group. Similarly, ...

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Abstract

The invention relates to an aqueous adhesive composition comprising a thermosetting resin including: at least one aromatic compound bearing at least two functions, one of said functions being a hydroxymethyl function, the other being an aldehyde function or a hydroxymethyl function, the aromatic compound comprising at least one aromatic ring; and at least one aromatic polyphenol comprising at least one aromatic ring bearing at least two hydroxyl functions in the meta position relative to one another, the two ortho-positions of at least one of the hydroxyl functions being non-substituted. Suchan adhesive composition can be used, in particular, to assemble wooden elements, and is an advantageous alternative to the use of a formaldehyde-based phenolic plastic glue.

Description

technical field [0001] The field of the invention relates to aqueous adhesive compositions intended to bond components, their use and methods for the manufacture of such compositions, methods of assembling components by means of these compositions and assemblies produced using these compositions. Background technique [0002] Bakelite or "phenolic resin" (the acronym PF) is derived from formaldehyde and phenol. Since phenol is a molecule with multiple reactive sites, a three-dimensional network is ultimately formed. Bakelites are used in particular as adhesives, for example for the manufacture of pressed wood or composite materials reinforced with glass fibres, textile fibres, etc. [0003] In the field of wood, phenol / aldehyde type compositions are described in US2360376. The composition comprises a phenol / aldehyde resin based on formaldehyde and phenol. The molar ratio of formaldehyde to phenol is in the range of 2 to 3.5. The composition is used in a method for bondin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/04C09J161/06C09J161/12C08J5/04D06M15/41D06M15/693C08J5/12
CPCC08G8/04C09J161/06C09J5/00C09J2400/303C09J2461/00C09J161/12B27N3/002D06M15/41C09J5/02C09J171/14
Inventor D·杜瓦诺C·米舒
Owner MICHELIN & CO CIE GEN DES ESTAB MICHELIN
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