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Composite microbial agent for electroplating wastewater treatment and its preparation and use method

A technology for compounding microbial inoculants and electroplating wastewater is applied in microorganism-based methods, biochemical equipment and methods, metallurgical wastewater treatment, etc. Solve the effect of reduced degradation efficiency and good system stability

Active Publication Date: 2022-03-11
重庆融极环保工程有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] At present, after the physical and chemical treatment of electroplating wastewater in the early stage, although the content of heavy metals has been greatly reduced, it still has a great impact on the biochemical section, and it is difficult for the biochemical section to operate stably for a long time

Method used

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  • Composite microbial agent for electroplating wastewater treatment and its preparation and use method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A compound microbial bacterial agent for electroplating wastewater treatment, the compound microbial bacterial agent is prepared according to the following volume ratio:

[0036] Bacillus subtilis 15%;

[0037] Bacillus licheniformis 15%;

[0038] Bacillus amyloliquefaciens subsp. 15%;

[0039] Bacillus amyloliquefaciens 15%;

[0040] Bacillus 10%;

[0041] Yeast 10%;

[0042] Bacillus cereus 10%;

[0043] Klebsiella 5%;

[0044] Acinetobacter baumannii 5%.

Embodiment 2

[0046] A compound microbial bacterial agent for electroplating wastewater treatment, the compound microbial bacterial agent is prepared according to the following volume ratio:

[0047] Bacillus subtilis 12%;

[0048] Bacillus licheniformis 12%;

[0049] Bacillus amyloliquefaciens subsp. 12%;

[0050] Bacillus amyloliquefaciens 12%;

[0051] Bacillus 12%;

[0052] Yeast 12%;

[0053] Bacillus cereus 12%;

[0054] Klebsiella 8%;

[0055] Acinetobacter baumannii 8%.

Embodiment 3

[0057] A compound microbial bacterial agent for electroplating wastewater treatment, the compound microbial bacterial agent is prepared according to the following volume ratio:

[0058] Bacillus subtilis 10%;

[0059] Bacillus licheniformis 10%;

[0060] Bacillus amyloliquefaciens subsp. 10%;

[0061] Bacillus amyloliquefaciens 10%;

[0062] Bacillus 15%;

[0063]Yeast 15%;

[0064] Bacillus cereus 15%;

[0065] Klebsiella 5%;

[0066] Acinetobacter baumannii 10%.

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Abstract

The invention discloses a composite microbial bacterial agent for electroplating wastewater treatment and a preparation and use method thereof. The method steps are as follows: (1), Bacillus subtilis, Bacillus licheniformis, Bacillus amyloliquefaciens subspecies, and Bacillus amyloliquefaciens Bacillus, Bacillus, Yeast, Bacillus cereus, Klebsiella, and Acinetobacter baumannii are uniformly mixed according to the volume ratio to form a composite bacterial agent; (2) The electroplating wastewater after physical and chemical treatment is continuously passed into the biochemical pool In the process, the bacteria agent described in (1) is added into the biochemical pool according to 0.05%-0.5% of the effective volume of the biochemical pool to carry out the biochemical reaction. The composite microbial agent can effectively reduce COD and ammonia nitrogen in the electroplating wastewater, solve the problem that the biochemical pool of the electroplating wastewater is easy to collapse, and improve the treatment efficiency. At the same time, the invention also has the advantages of low cost, no pollution, no toxicity, high efficiency, Easy to implement and other advantages.

Description

technical field [0001] The invention belongs to the technical field of electroplating wastewater treatment, and in particular relates to a composite microbial bacterial agent for electroplating wastewater treatment and a preparation and use method. Background technique [0002] Electroplating is a process in which the plated parts undergo chemical or electrochemical reactions in the plating tank to obtain a metal protective layer. The main source of electroplating wastewater is the cleaning water of the plating parts, the filtering water of the plating parts, the waste plating solution and the "running, running, dripping and leaking" caused by improper operation or poor management in the electroplating production process; in addition, there are wastewater treatment processes Discharge of self-owned water and drainage of laboratory tests. Electroplating wastewater mainly contains heavy metal ions such as chromium, zinc, copper, cadmium, lead, nickel, etc., as well as acids a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C12N1/20C12N1/16C02F3/34C12R1/125C12R1/10C12R1/07C12R1/645C12R1/085C12R1/22C12R1/01C02F103/16
CPCC12N1/16C12N1/20C02F3/34C02F3/347C02F3/348C02F2103/16
Inventor 李大荣杨平贾春燕燕艳
Owner 重庆融极环保工程有限公司
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