MWT integrated backplane composite method
A backplane and pressure plate technology, which is applied in the field of photovoltaic cell integrated backplane manufacturing, can solve the problems of relative position changes between the cell board and the backplane, low product qualification rate, impact on output and quality, etc. The effect of fast bonding process and improving product qualification rate
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Embodiment 1
[0016] Such as figure 1 Shown, a kind of MWT integrated backplane composite method comprises the following steps:
[0017] (1) Place the backplane on the carrier board for glue brushing, and brush glue along the long sides of the backplane, such as figure 2 As shown, the glue brushing position is 100mm away from the long edge of the backplane, and the glue brushing width is 200mm;
[0018] (2) Center the pad of the conductive core board on the opening position of the backboard, the distance between the long side edge of the conductive core board and the long side edge of the backboard is 14mm, and the short side edge of the conductive core board is on the side of the short side edge of the backboard The distance is 19mm, and the other side is 17mm to confirm the position;
[0019] (3) Transfer the back plate after the position confirmed in step (2) to the pressurized lamination area of the press plate; adjust the pressure of the press plate to carry out pressure laminatio...
Embodiment 2
[0022] Such as figure 1 Shown, a kind of MWT integrated backplane composite method comprises the following steps:
[0023] (1) Place the backplane on the carrier board for glue brushing, and brush glue along the long sides of the backplane, such as figure 2 As shown, the glue brushing position is 100mm away from the long edge of the backplane, and the glue brushing width is 200mm;
[0024] (2) Center the pad of the conductive core board on the opening position of the backboard, the distance between the long side edge of the conductive core board and the long side edge of the backboard is 15mm, and the short side edge of the conductive core board is on the side of the short side edge of the backboard The distance is 20mm, and the other side is 18mm to confirm the position;
[0025] (3) Transfer the back plate after the position confirmed in step (2) to the pressurized lamination area of the press plate; adjust the pressure of the press plate to carry out pressure laminatio...
Embodiment 3
[0028] Such as figure 1 Shown, a kind of MWT integrated backplane composite method comprises the following steps:
[0029] (1) Place the backplane on the carrier board for glue brushing, and brush glue along the long sides of the backplane, such as figure 2 As shown, the glue brushing position is 100mm away from the long edge of the backplane, and the glue brushing width is 200mm;
[0030] (2) Center the pad of the conductive core board on the opening position of the backboard, the distance between the long side edge of the conductive core board and the long side edge of the backboard is 16mm, and the short side edge of the conductive core board is on the side of the short side edge of the backboard The distance is 21mm, and the other side is 19mm to confirm the position;
[0031] (3) Transfer the back plate after the position confirmed in step (2) to the pressurized lamination area of the press plate; adjust the pressure of the press plate to carry out pressure laminatio...
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