MWT integrated backplane composite method

A backplane and pressure plate technology, which is applied in the field of photovoltaic cell integrated backplane manufacturing, can solve the problems of relative position changes between the cell board and the backplane, low product qualification rate, impact on output and quality, etc. The effect of fast bonding process and improving product qualification rate

Inactive Publication Date: 2019-03-29
JIANGSU SUNPORT POWER CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the lamination process, the thermal stability of each packaging material is inconsistent, which may easily lead to changes in the relative position of the conductive core board and the back board, and various defects in the finished component
Therefore, the MWT integrated backplane is particularly important. At present, the MWT integrated backplane mainly relies on artificial heating and compounding. The artificial heating and compounding process will cause failure of raw materials, and the artificial heating and compounding process is slow, which affects the output and quality, resulting in a low product qualification rate.

Method used

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  • MWT integrated backplane composite method
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Examples

Experimental program
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Effect test

Embodiment 1

[0016] Such as figure 1 Shown, a kind of MWT integrated backplane composite method comprises the following steps:

[0017] (1) Place the backplane on the carrier board for glue brushing, and brush glue along the long sides of the backplane, such as figure 2 As shown, the glue brushing position is 100mm away from the long edge of the backplane, and the glue brushing width is 200mm;

[0018] (2) Center the pad of the conductive core board on the opening position of the backboard, the distance between the long side edge of the conductive core board and the long side edge of the backboard is 14mm, and the short side edge of the conductive core board is on the side of the short side edge of the backboard The distance is 19mm, and the other side is 17mm to confirm the position;

[0019] (3) Transfer the back plate after the position confirmed in step (2) to the pressurized lamination area of ​​the press plate; adjust the pressure of the press plate to carry out pressure laminatio...

Embodiment 2

[0022] Such as figure 1 Shown, a kind of MWT integrated backplane composite method comprises the following steps:

[0023] (1) Place the backplane on the carrier board for glue brushing, and brush glue along the long sides of the backplane, such as figure 2 As shown, the glue brushing position is 100mm away from the long edge of the backplane, and the glue brushing width is 200mm;

[0024] (2) Center the pad of the conductive core board on the opening position of the backboard, the distance between the long side edge of the conductive core board and the long side edge of the backboard is 15mm, and the short side edge of the conductive core board is on the side of the short side edge of the backboard The distance is 20mm, and the other side is 18mm to confirm the position;

[0025] (3) Transfer the back plate after the position confirmed in step (2) to the pressurized lamination area of ​​the press plate; adjust the pressure of the press plate to carry out pressure laminatio...

Embodiment 3

[0028] Such as figure 1 Shown, a kind of MWT integrated backplane composite method comprises the following steps:

[0029] (1) Place the backplane on the carrier board for glue brushing, and brush glue along the long sides of the backplane, such as figure 2 As shown, the glue brushing position is 100mm away from the long edge of the backplane, and the glue brushing width is 200mm;

[0030] (2) Center the pad of the conductive core board on the opening position of the backboard, the distance between the long side edge of the conductive core board and the long side edge of the backboard is 16mm, and the short side edge of the conductive core board is on the side of the short side edge of the backboard The distance is 21mm, and the other side is 19mm to confirm the position;

[0031] (3) Transfer the back plate after the position confirmed in step (2) to the pressurized lamination area of ​​the press plate; adjust the pressure of the press plate to carry out pressure laminatio...

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Abstract

The invention discloses a MWT integrated backplane composite method and belongs to the field of photovoltaic cell integrated backplane manufacture to improve the production efficiency and the qualityof an integrated backplane, and improve a product qualified rate. The method comprises the following steps: (1) placing the backplane on an adhesive carrier plate, brushing an adhesive along the two long sides of the backplane; (2) centering the bonding pads of a conductive core board at the hole positions of the backplane, and confirming the positions; (3) transferring the backplane with the positions confirmed in the step (2) to a pressure plate pressurizing composite area, adjusting the pressure of the pressure plate, and performing pressure compositing; and (4) lifting a corner of the backplane pressurized and composited in the step (3) for 3s, if the conductive core board and the backplane are not separated, the integrated backplane is composited.

Description

technical field [0001] The invention belongs to the field of photovoltaic cell integrated backplane manufacturing, and in particular relates to a method for compounding MWT integrated backplanes. Background technique [0002] MWT integrated backsheet is one of the key materials for photovoltaic module packaging. MWT photovoltaic module is made of tempered glass, battery pack, GPS, conductive core board and backsheet through curing and bonding of EVA under certain temperature and pressure. During the lamination process, the thermal stability of each packaging material is inconsistent, which can easily lead to changes in the relative position of the conductive core board and the back board, and various defects in the finished component. Therefore, the MWT integrated backplane is particularly important. At this stage, the MWT integrated backplane mainly relies on artificial heating and lamination. The artificial heating and lamination process will cause failure of raw materials...

Claims

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Application Information

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IPC IPC(8): H01L31/18H01L31/049B32B37/12B32B37/10
CPCB32B37/10B32B37/1292H01L31/049H01L31/1876Y02E10/50Y02P70/50
Inventor杜秋壮路忠林吴仕梁张凤鸣
OwnerJIANGSU SUNPORT POWER CORP LTD