Storage expansion method and device of main control memory, readable storage medium and system

A technology of storage expansion and storage medium, which is applied to the storage expansion method of the main control memory, storage medium and system, and the field of devices, which can solve the problems of high cost

Active Publication Date: 2019-04-05
YEESTOR MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a storage expansion method of the main control memory, aiming at solving the technical problem of high cost in the prior art when the main control expands the memory

Method used

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  • Storage expansion method and device of main control memory, readable storage medium and system
  • Storage expansion method and device of main control memory, readable storage medium and system
  • Storage expansion method and device of main control memory, readable storage medium and system

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Embodiment Construction

[0026] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] The main solution of the embodiment of the present invention is: according to the data application requirements, confirm the space amount of the data application memory storage space corresponding to the data application requirements; according to the confirmed data application memory storage space space amount, and the Flash The size of the Buff capacity confirms the scrap flash corresponding to the target quantity, wherein the target scrap flash includes one or more; encapsulates the confirmed target scrap flash as a target extended flash, and calls the target extended flash through the preset scrap flash controller as The data application storage space.

[0028] Due to the way of the main control integrated DRAM in the storage scheme of the prior art, the cost of the DRAM itself is high when the memory is ex...

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Abstract

The invention discloses a storage expansion method for a main control memory, which comprises the following steps: confirming the space quantity of a memory storage space corresponding to a data application demand according to the data application demand; Confirming the number of target sctrap flash based on a preset sctrap flash controller according to the space quantity of the memory storage space of the data application, the number of the target sctrap flash being one or more; And finally, packaging the confirmed target sctrap flash into a target expansion flash, and calling the target expansion flash as the data application memory storage space through a preset sctrap flash controller. The invention further discloses a storage expansion device of the main control memory, a readable storage medium and a system. According to the method, the sctrap Flash and the Flash are packaged according to the current data storage requirement, and the data are stored and the memory is expanded through the packaged Flash, so that the beneficial effect of improving the application performance at the lowest cost is achieved.

Description

technical field [0001] The present invention relates to the technical field of storage expansion applications, in particular to a storage expansion method, device, storage medium and system for a main control memory. Background technique [0002] The size of the Buff (memory expansion) of the storage master has a great impact on the cost of the chip. The size of the design Buff is fixed after the chip is mass-produced. become a restrictive factor. When the existing technology solves the problem of the size of the Buff, a part of the data is stored in the Flash (flash memory), and dynamically read from the Flash to the Buff when it needs to be used, and the application of this method reduces the performance of the chip. In addition, if the storage master integrates other types of Cache (cache, such as DRAM) as a supplement to the buff to solve the problem of the size of the buff, the cost of the master chip will be greatly increased. [0003] The above content is only used ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/06
CPCG06F3/0608G06F3/0667G06F3/0679
Inventor 杨继光吴大畏李晓强
Owner YEESTOR MICROELECTRONICS CO LTD
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