High-speed precision bonding wire platform and control method thereof

Abstract

The invention relates to a high-speed precision bonding wire platform and a control method thereof. The high-speed precision bonding wire platform comprises a macro XY motion platform, a micro XY motion platform, an element bracket and a bonding wire mechanism. The element bracket is mounted on the macro XY motion platform. The micro XY motion platform comprises a support seat, a connecting bracket, a micro bearing platform, an X-axis flexible hinge piece and a Y-axis flexible hinge piece. The two ends of the X-axis flexible hinge piece are fixed to the connecting bracket and the support seat correspondingly. The two ends of the Y-axis flexible hinge piece are fixed to the connecting bracket and the micro bearing platform correspondingly. The micro bearing platform is provided with a micro X-axis encoder and a micro Y-axis encoder, and the micro X-axis encoder and the micro Y-axis encoder are used for measuring motion information, formed in the X direction and the Y direction, of the micro bearing platform. The bonding wire mechanism is mounted on the micro bearing platform of the micro XY motion platform. According to the high-speed precision bonding wire platform and the control method thereof, high-speed interpolation is achieved through elastic deformation of flexible hinges, and inter-hole high-speed precision locating is achieved.

Description

technical field [0001] The present invention relates to the technical field of high-precision wire bonding, and more specifically, to a high-speed precision wire bonding platform and a control method thereof. Background technique [0002] Electronic manufacturing is developing in the direction of high density, narrow pitch, and short pins. The pitch of the leads ranges from millimeters to microns in high-density distribution. In order to achieve high-speed and high-precision movement, existing high-end wire bonding equipment is generally driven by voice coil motors. Low-friction crossed ball rail guidance. However, short-range high-frequency movements cause localized wear of the cross ball guides. The traditional high-precision wire bonding machine uses cross ball guide rails, and frequent narrow-pitch high-speed reciprocating wire bonding will cause local wear of the cross ball screw. Contents of the invention [0003] In order to overcome at least one defect of the abo...

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