Low-temperature cured OC negative photoresist, insulation bridge, protection layer and OLED device

A negative-type photoresist and curing technology, which is applied in the field of negative-type transparent photoresist, can solve the problems of high profile slope angle, poor precision, and inconsistent polarity matching

Active Publication Date: 2020-01-10
深圳市邦得凌半导体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the molecular weight (M.w) is excessively increased and the cross-linking is excessive, the polarity matching between the components will not be uniform, and the following problems will occur: the accuracy of the "bridge" pattern during development will deteriorate, and the slope angle of the Profile will be too high.

Method used

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  • Low-temperature cured OC negative photoresist, insulation bridge, protection layer and OLED device
  • Low-temperature cured OC negative photoresist, insulation bridge, protection layer and OLED device
  • Low-temperature cured OC negative photoresist, insulation bridge, protection layer and OLED device

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preparation example Construction

[0090] The preparation method of the low-temperature curing type OC negative photoresist is: first dissolving the low-temperature curing polymer resin and the oligomer crosslinking agent containing ethylenic double bonds in a certain amount of solvent; then dissolving the photoinitiator at a certain temperature In organic solvents, it is usually added at 35-50°C; finally, other components in the above formula are added, mixed thoroughly, filled cleanly, and stored at 0-5°C.

[0091]

[0092] In the above table, the free radical photoinitiator is the photoinitiator shown in formula 6-2; the hydrogen abstraction photoinitiator is the photoinitiator shown in formula 6-8; the hydrogen donor photoinitiator is 6-16 The photoinitiator shown; the visible photoinitiator is the photoinitiator shown in formula 6-18.

[0093]In the above table, the oligomer crosslinking agent containing ethylenic double bond is 3-hydroxyethyl pentaerythritol triacrylate; the methacrylic acid copolymer ...

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Abstract

The invention discloses a low-temperature cured OC negative photoresist, which is prepared from the following components in parts by weight: 5-30 parts of low-temperature cured polymer resin, 5-30 parts of methacrylic acid copolymer resin, 5-30 parts of an oligomer cross-linking agent containing olefinic double bonds, 0.2-2 parts of a photo-induced free radical initiator, 0.5-3 parts of an additive and 70-90 parts of a solvent. When the negative photoresist is used for manufacturing a structural layer of a flexible folding display screen or a capacitive touch screen, the negative photoresist can be cured at the temperature of 85-150 DEG C, and has acid and alkali resistance, solvent resistance, film stripping liquid resistance and copper etching liquid corrosion resistance; oxygen-resistant ICP dry etching is carried out, and metal coating is performed at the temperature of 25-100 DEG C;, the square resistance is stabilized within the range from 5.0E*10<12> and 5.0E*10<14> under the 100 DEG C / 85% high-humidity environment, and the light transmittance is 99%. The invention further provides an insulation bridge and a protection layer which are made of the negative photoresist, a preparation process and an OLED device.

Description

technical field [0001] The invention relates to a negative transparent photoresist, in particular to a low-temperature curing OC negative photoresist in the manufacturing process of a touch screen or a display screen and a process method thereof, that is, the photoresist is produced through a yellow light process. It is a new material in the field of communication materials electronics for touch screen devices. Background technique [0002] At present, the mainstream technology in the field of touch display is capacitive touch screen. The advantages of capacitive screens are fast response and good touch accuracy, which improves the customer's operating experience. In particular, the current mainstream projected capacitive touch screen overcomes the shortcomings of low light transmittance and high energy consumption, and its performance has been significantly improved. [0003] The projected capacitive screen panel is generally placed under the transparent substrate, and ca...

Claims

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Application Information

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IPC IPC(8): G03F7/038H01L51/50
CPCG03F7/038H10K50/00
Inventor薛晖运向军李伟任广辅扈志常爱芹
Owner深圳市邦得凌半导体材料有限公司