Low-temperature cured OC negative photoresist, insulation bridge, protection layer and OLED device
A negative-type photoresist and curing technology, which is applied in the field of negative-type transparent photoresist, can solve the problems of high profile slope angle, poor precision, and inconsistent polarity matching
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[0090] The preparation method of the low-temperature curing type OC negative photoresist is: first dissolving the low-temperature curing polymer resin and the oligomer crosslinking agent containing ethylenic double bonds in a certain amount of solvent; then dissolving the photoinitiator at a certain temperature In organic solvents, it is usually added at 35-50°C; finally, other components in the above formula are added, mixed thoroughly, filled cleanly, and stored at 0-5°C.
[0091]
[0092] In the above table, the free radical photoinitiator is the photoinitiator shown in formula 6-2; the hydrogen abstraction photoinitiator is the photoinitiator shown in formula 6-8; the hydrogen donor photoinitiator is 6-16 The photoinitiator shown; the visible photoinitiator is the photoinitiator shown in formula 6-18.
[0093]In the above table, the oligomer crosslinking agent containing ethylenic double bond is 3-hydroxyethyl pentaerythritol triacrylate; the methacrylic acid copolymer ...
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