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Liquid cooling heat dissipation device capable of dissipating heat of multiple heat sources

A liquid-cooled heat dissipation technology with multiple heat sources, applied in the fields of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of liquid leakage, many joints, large volume, etc., to reduce the risk of leakage, save space, Easy to assemble effect

Pending Publication Date: 2020-11-03
APALTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, although the existing liquid-cooled cooling devices that can dissipate heat from multiple heat sources can provide various types of heat dissipation at the same time, their combined volume is large, and when applied to server equipment, the overall size of the equipment will become larger; In addition, because there are many joints and they are exposed, there is a problem of liquid leakage.

Method used

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  • Liquid cooling heat dissipation device capable of dissipating heat of multiple heat sources
  • Liquid cooling heat dissipation device capable of dissipating heat of multiple heat sources
  • Liquid cooling heat dissipation device capable of dissipating heat of multiple heat sources

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Embodiment Construction

[0039] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

[0040] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude one or more other Presence or addition of characteristics, wholes, steps, operations, elements, components and / or collections.

[0041]In order t...

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Abstract

The invention relates to a liquid cooling heat dissipation device capable of dissipating heat of multiple heat sources, and the device comprises a first water tank, a second water tank, a water cooling row assembly, a heat absorption assembly and a water pump, and is characterized in that the first water tank is provided with a plurality of first water storage tanks which are adjacent to one another but not communicated with one another; the second water tank and the first water tank are arranged at an interval and are provided with a plurality of second water storage tanks, and the second water storage tanks are adjacent but not communicated; the water cooling row assemblies are arranged between the first water tank and the second water tank side by side and communicate with the first water storage tank and the second water storage tank. The heat absorption assembly communicates with the second water storage tank; and the water pump is arranged in each water storage tank. Therefore, different heat sources can be provided for use at the same time, the structure is compact, and the occupied space is small.

Description

technical field [0001] The invention relates to a technology of a liquid cooling heat dissipation device, in particular to a liquid cooling heat dissipation device capable of dissipating heat from multiple heat sources. Background technique [0002] As the calculation speed of electronic components continues to increase, the heat generated by them is also increasing. In order to effectively solve the problem of high heat generation, the industry has developed heat pipes or vapor chambers with high conductivity and high heat dissipation efficiency. Technicians are designing and researching towards the direction of water-cooled heat sinks. [0003] Existing water cooling devices mainly include a water cooling head, a water pump, a water tank, a water cooling row and a plurality of water delivery hoses, wherein the water cooling head, the water pump and the water cooling row are mostly connected through water delivery hoses and joints. In order to meet the heat dissipation req...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20Y02D10/00
Inventor 肖启能
Owner APALTEK CO LTD
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