Magnetic jig and multilayer FPC welding method

A welding method and magnetic technology, applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve the problems of low utilization rate of circuit boards, low welding accuracy, high labor costs, etc., to improve poor welding, avoid false welding, The effect of low coefficient of friction

CN112135439AActive Publication Date: 2020-12-25成都大超科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2020-12-25

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Abstract

The invention relates to a magnetic jig which comprises a magnetic pressure board and a magnetic carrier board. A plurality of magnetic beads are arranged in the magnetic carrier board, and the size and the number of the magnetic beads are adjusted to control the attraction force of the magnetic carrier board to the magnetic pressure board. The invention relates to a multilayer interconnection FPCwelding method, which comprises the magnetic jig and comprises the following steps of: S1, reinforcing the bottom of a main board; S2, carrying out tinning processing on a main output bonding pad anda main input bonding pad; S3, pasting a layer of double faced adhesive tape on the surface, close to a secondary board, of the main board or the surface, close to the main board, of the secondary board; S4, aligning the main board with the secondary board, and attaching the secondary board to the main board after alignment; and S5, placing the secondary board and the main board on a magnetic carrier board, pressing the magnetic pressure board onto the secondary board by using magnetic attraction of the magnetic pressure board and the magnetic carrier board, and applying proper pressure to themagnetic pressure board. According to the invention, poor welding caused by surface tension can be improved.
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Description

Technical field

[0001] The invention belongs to the technical field of circuit boards, in particular to a magnetic fixture and a multilayer FPC welding method.

Background technique

[0002] Whether it is a printed circuit board or a flexible circuit board, there is a problem of line crossing, but the wiring cannot be crossed, so it is necessary to mount another circuit board on one circuit board, and the unavoidable crossing lines are placed on another circuit board. Arrangement without crossing. When the actual intersecting lines are relatively simple and few, using a circuit board with a large area will cause the disadvantages of low utilization rate and high cost. At the same time, the quality of the product is affected by whether there is good contact between the two circuit boards. If welding is performed manually, the accuracy of welding is low, the scrap rate is high, and the labor cost is high.

Content of invention

[0003] In order to overcome the problems...

Examples

Embodiment Construction

[0032] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0033] see figure 1 and figure 2, the first embodiment of the present invention provides a multilayer interconnection electronic circuit board 1, the multilayer interconnection electronic circuit board 1 includes a main board 11 and one or more jumper boards 12, and the jumper boards 12 are far away from the main board One side of 11 is provided with a jumper line (not shown in the figure), and the side of the jumper board 12 close to the main board 11 is provided with a plurality of docking pads 121, and the butt pads 121 are provided with via holes 1211, The connecting pad 121...