High-order perturbation method applied to TM wave incident random rough electric conductor surface scattering condition

A technology of surface scattering and rough surface, which is applied in the field of communication and can solve problems such as complex mathematical expressions, no application of general forms, and complex codes.

Pending Publication Date: 2021-01-05
XIDIAN UNIV
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Problems solved by technology

However, most SPMs can only be solved under the condition of finite series
Usually, as the order of solution increases, the dimension of the integral also increases. When the algorithm contains multiple integrals, t

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  • High-order perturbation method applied to TM wave incident random rough electric conductor surface scattering condition
  • High-order perturbation method applied to TM wave incident random rough electric conductor surface scattering condition
  • High-order perturbation method applied to TM wave incident random rough electric conductor surface scattering condition

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Embodiment Construction

[0085] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0086] see Figure 1-5 , the present invention provides the following technical solutions: a high-order perturbation method applied to TM wave incident random rough electric conductor surface scattering, comprising the following steps:

[0087] S1: Parametric processing of the problem model;

[0088] S2: use the HOSPM method to process;

[0089] S3: Result calculation.

[0090] Specifically, in step S1, the specific steps of problem model parameterization p...

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Abstract

The invention discloses a high-order perturbation method applied to the surface scattering condition of a TM wave incident random rough electric conductor, and belongs to the technical field of communication, and the method comprises the following steps: S1, performing problem model parameterization processing; S2, processing by using a HOSPM method; and S3, calculating a result. according to theinvention, the HOSPM can obtain a general form of any order of a traditional SPM; the feasibility of the method is proved by comparing the BSCs obtained by two different methods of HOSPM and MOM, theaccuracy of the method is proved by calculating different related lengths and root mean square heights, the HOSPM is proved to have higher efficiency by comparing the operation time of HOSPM and MOM,the calculation precision can be ensured, meanwhile, the integral process for solving the electromagnetic scattering problem is simplified as much as possible, so that the calculation time is greatlyshortened, and the method can be widely applied to the random rough scattering problem.

Description

technical field [0001] The invention belongs to the technical field of communication, and in particular relates to a high-order perturbation method applied to the surface scattering of TM waves incident on random rough electric conductors. Background technique [0002] The scattering of electromagnetic waves on random rough surfaces has been an important research topic in many different fields in recent decades. Its application prospects include remote sensing, communication, medical imaging and applied optics. Many analysis methods have been developed and successfully analyzed. solves some surface scattering problems. [0003] The current common analysis methods can be divided into three categories: 1) approximate method; 2) numerical method; 3) semi-analytical method. The approximation method is a method based on physical approximation, which provides an analytical formula for the scattering field; the main idea of ​​the numerical method is to discretize the variables of ...

Claims

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Application Information

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IPC IPC(8): G06F17/10
CPCG06F17/10
Inventor 王青于璞侯建强江山雷振亚李磊顾宸光杨锐
Owner XIDIAN UNIV
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