Circuit substrate turnover device and method thereof

Abstract

The invention belongs to the technical field of circuit sub-substrate automatic production, and particularly relates to a circuit substrate turnover device which comprises a turnover suction assemblyand a turnover driving assembly. The turnover suction assembly is used for sucking the circuit substrate and placing the circuit substrate on the turnover driving assembly, and the turnover driving assembly is used for turning over the circuit substrate; a turnover horizontal moving electric cylinder is arranged on a rack, a turnover horizontal moving frame is arranged on a moving part of the turnover horizontal moving electric cylinder, a turnover lifting frame is arranged on the turnover horizontal moving frame through a turnover lifting sliding rail, and a turnover lifting spring is arranged at the bottom of the turnover lifting frame; an overturning air cylinder is arranged on the overturning lifting frame, an overturning rotating shaft is connected with a rotating part of the overturning air cylinder, and the overturning rotating shaft penetrates through the overturning lifting frame to be connected with an overturning plate. The circuit substrate turnover device has the advantageof realizing automatic double-sided copper film pressing of the circuit substrate.

Description

technical field [0001] The invention belongs to the technical field of circuit substrate automatic production, and in particular relates to a circuit substrate turning device and a method thereof. Background technique [0002] With the gradual deepening of electronic technology in various application fields, highly integrated circuit boards have become an inevitable trend. Highly integrated package modules require a good heat dissipation carrying system, while traditional circuit boards FR-4 and CEM-3 are in TC (thermal conductivity ) has become a bottleneck restricting the development of electronic technology. The LED industry, which has developed rapidly in recent years, has also put forward higher requirements for the TC index of its load-carrying circuit boards. In the field of high-power LED lighting, materials with good heat dissipation properties such as metal and ceramics are often used to prepare circuit substrates. [0003] The circuit substrate is a thermally co...

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Problems solved by technology

[0007] The purpose of the present invention is to solve the above-mentioned problem that the existing circuit substrate can only be laminated on one side, and to provide a circuit substrate turning device, which can stably pick up the circuit substrate through the turning suction component, and place it on the turning drive component On the top, the circuit substrate is turned over by 180° by turning over the drive component to realize double-sided lamination and improve lamination efficiency

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