Novel glass packaging method

A new type of glass packaging technology, applied in the field of glass packaging, can solve the problems of poor insulation, large package base size, small pin spacing, etc., and achieve the basic insulation resistance and withstand voltage, the insulation resistance and withstand voltage are consistent, The effect of stable insulation performance

CN112456820APending Publication Date: 2021-03-09陕西联航科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2021-03-09

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Abstract

The invention belongs to the technical field of glass packaging, and discloses a novel glass packaging method which comprises the following steps: reducing the distance between contact pins by adjusting the proportion of SiO2, P2O5, B2O3, Li2O, ZnO, BaO, K2O and Na2O, and a four-position positioning method is adopted to position the contact pins from upper, lower, left and right directions by adding a mold, so that novel glass packaging is realized. According to the invention, a novel glass packaging technology is used, so that the distance between the pins is reduced to 0.6 mm, and the requirements that the insulation resistance is 1000 megohms and the withstand voltage is 500 V are met at the same time. Under the condition that the original glass packaging cost is not changed, the size of the product is reduced by 40%. According to the invention, a four-position positioning method is adopted, i.e., the contact pin is positioned in the upper, lower, left and right directions by addingthe mold, so that the contact pin is prevented from position change during re-sintering.
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Description

technical field

[0001] The invention belongs to the technical field of glass encapsulation, and in particular relates to a novel glass encapsulation method. Background technique

[0002] At present: glass is more and more widely used in people's daily life, not only in the field of construction, but also in many daily necessities. The commonly used glass is transparent and can maintain a good lighting effect. Especially in buildings, insulating glass is generally used in doors and windows to prevent the indoor temperature from being affected by the external environment for heat preservation and lighting. At the same time, it needs to consume additional energy to maintain the comfort of the indoor environment. Existing glass packaging components need to achieve an insulation resistance of 1000MΩ, a withstand voltage of 500V, and a minimum distance of 1mm between two pins. In the case of more pins, the size of the package base is too large, resulting in a large overall size. ...

Examples

Embodiment Construction

[0040] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0041] Aiming at the problems existing in the prior art, the present invention provides a novel glass encapsulation method. The present invention will be described in detail below with reference to the accompanying drawings.

[0042] Such as figure 1 As shown, the novel glass encapsulation method provided by the embodiment of the present invention includes:

[0043] S101, by adjusting the SiO 2 ,P 2 o 5 , B 2 o 3 , Li 2 O, ZnO, BaO, K 2 O, Na 2 The matching ratio between O reduces the pitch of pins.

[0044] S102, using the four-position positioning method, by adding molds to position the pins from four directions...