Novel glass packaging method

Abstract

The invention belongs to the technical field of glass packaging, and discloses a novel glass packaging method which comprises the following steps: reducing the distance between contact pins by adjusting the proportion of SiO2, P2O5, B2O3, Li2O, ZnO, BaO, K2O and Na2O, and a four-position positioning method is adopted to position the contact pins from upper, lower, left and right directions by adding a mold, so that novel glass packaging is realized. According to the invention, a novel glass packaging technology is used, so that the distance between the pins is reduced to 0.6 mm, and the requirements that the insulation resistance is 1000 megohms and the withstand voltage is 500 V are met at the same time. Under the condition that the original glass packaging cost is not changed, the size of the product is reduced by 40%. According to the invention, a four-position positioning method is adopted, i.e., the contact pin is positioned in the upper, lower, left and right directions by addingthe mold, so that the contact pin is prevented from position change during re-sintering.

Description

technical field [0001] The invention belongs to the technical field of glass encapsulation, and in particular relates to a novel glass encapsulation method. Background technique [0002] At present: glass is more and more widely used in people's daily life, not only in the field of construction, but also in many daily necessities. The commonly used glass is transparent and can maintain a good lighting effect. Especially in buildings, insulating glass is generally used in doors and windows to prevent the indoor temperature from being affected by the external environment for heat preservation and lighting. At the same time, it needs to consume additional energy to maintain the comfort of the indoor environment. Existing glass packaging components need to achieve an insulation resistance of 1000MΩ, a withstand voltage of 500V, and a minimum distance of 1mm between two pins. In the case of more pins, the size of the package base is too large, resulting in a large overall size. ...

AI Technical Summary

Problems solved by technology

However, the pitch of the pins is small, and the pins are thinner. By positioning the upper and lower molds, it is impossible to ensure that the position of the pins will not change when they are sintered again.

[0003] Through the above analysis, the problems and defects of the existing technology are: the existing glass packaging conditions are harsh, the minimum distance between the two pins is 1mm, the size of the package base is too large, the size of the whole part is large, and the manufacturing wastes materials. It

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