The invention belongs to the technical field of glass packaging, and discloses a novel glass packaging method which comprises the following steps: reducing the distance between contact pins by adjusting the proportion of SiO2, P2O5, B2O3, Li2O, ZnO, BaO, K2O and Na2O, and a four-position positioning method is adopted to position the contact pins from upper, lower, left and right directions by adding a mold, so that novel glass packaging is realized. According to the invention, a novel glass packaging technology is used, so that the distance between the pins is reduced to 0.6 mm, and the requirements that the insulation resistance is 1000 megohms and the withstand voltage is 500 V are met at the same time. Under the condition that the original glass packaging cost is not changed, the size of the product is reduced by 40%. According to the invention, a four-position positioning method is adopted, i.e., the contact pin is positioned in the upper, lower, left and right directions by addingthe mold, so that the contact pin is prevented from position change during re-sintering.