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Field device for process automation

A process automation, field equipment technology, applied in the direction of electrical equipment shell/cabinet/drawer, circuit bendable/stretchable parts, printed circuit connected with non-printed electrical components, etc., can solve the material of compensation components Weakness, damage, etc.

Inactive Publication Date: 2018-03-30
ENDRESSHAUSER CONDUCTA GMBHCO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The disadvantage of using a plug-in connector such as a movable compensating element is that if the printed circuit board changes thermally in length relative to the housing, the printed circuit board can slide inside the plug-in connector, or the material of the compensating element is shifting excessively weakened by the case or damaged by abrasion

Method used

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  • Field device for process automation
  • Field device for process automation
  • Field device for process automation

Examples

Experimental program
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Embodiment Construction

[0026] figure 1 A plan view of the printed circuit board 1 of an automated field device is shown.

[0027] In the field of process automation, explosion-proof electronic device housings are often required. From a favorable point of view of thermal stress, it is difficult to attach the printed circuit board 1 to the housing 3 in the method required for explosion protection; the main method used for the design of an explosion-proof circuit in the prior art includes filling the housing 3 with a plastic infusion mixture. This makes it possible, for example, to safely electrically insulate energy storage stations containing enough energy to ignite an environment in which explosive gases or dust may be present. Conventionally, relevant explosion-proof standards require that the potting compound be bonded to the printed circuit board 1 and the housing 3.

[0028] The problem with attaching the printed circuit board 1 to the housing 3 and thermal stress is that, generally, the potting mix...

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PUM

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Abstract

The invention relates to a field device for process automation. The field device for process automation comprises a housing (3) and a printed circuit board (1), wherein the printed circuit board (1) and housing (3) have at least one common fixation region (14) by which a relative movement of the printed circuit board (1) within the housing (3) is prevented. The field device is characterized in that the printed circuit board (1) has at least one opening (2) to compensate for diverging changes in length between the printed circuit board (1) and housing (3).

Description

Technical field [0001] The present invention relates to a field device for process automation, which includes a housing and a printed circuit board, wherein the printed circuit board is firmly attached to the housing. Background technique [0002] The printed circuit board (PCB) is the carrier of the electronic components. It is used for mechanical attachment and electrical connection. Almost every electronic device contains one or more printed circuit boards. A printed circuit board is composed of an electrically insulating material, which has conductive connections bonded to it, called conductive tape. Fiber-reinforced plastics are commonly used as insulation materials. The conductive tape is usually etched from a thin copper layer. The thermal expansion coefficient of plastic is almost exactly adapted to the expansion coefficient of copper (approximately 17ppm / K) to avoid the so-called delamination during temperature changes. [0003] This adaptation necessitates the use of...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0271G01D11/245H05K2201/09063H05K2203/1327H05K5/064H05K1/0278H05K1/0203H05K1/028H05K1/18H05K3/4691
Inventor 比约恩·哈斯雅诺什·阿尔温齐克里斯托弗·费克尔哈希姆·阿姆罗
Owner ENDRESSHAUSER CONDUCTA GMBHCO
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