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A back-drilling method for pcb board and pcb board

A PCB board and back-drilling technology, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve the problems of high risk of residual copper and difficulty in obtaining PCB boards accurately, and achieve the goal of reducing the risk of residual copper and reducing hole deviation Effect

Active Publication Date: 2022-02-25
SHENNAN CIRCUITS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This application provides a method for back-drilling PCB boards to solve the technical problem that it is difficult to accurately obtain the entry hole position for back-drilling PCB boards in the prior art, resulting in a high risk of residual copper

Method used

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  • A back-drilling method for pcb board and pcb board
  • A back-drilling method for pcb board and pcb board
  • A back-drilling method for pcb board and pcb board

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Embodiment Construction

[0026] In order to make the technical problems solved by the present application, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0027] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0028] see Figure 1a-Figure 1e ,in, Figure 1a It is a schematic flow chart of the fir...

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Abstract

The application discloses a back-drilling method of a PCB board and a PCB board, wherein the back-drilling method of the PCB board includes: a backing board is superimposed between the PCB board and the backing board; Drill through holes with the tool, and run through the PCB board and the sub-backing board; obtain the position of the tool-entry hole on the first surface of the secondary backing plate facing the PCB board, so that after the preliminary processing of the PCB board, according to the position of the tool-entry hole by The second surface on the other side of the PCB board enters the tool to back drill the PCB board. Through the above method, the present application can refer to the backing board once when drilling the through hole on the PCB board, so as to obtain the entry hole position when back drilling the PCB board more accurately through the backing board, so as to be able to Without losing the hole position accuracy of the remaining copper holes after back-drilling, the hole deviation between through holes and back-drilled holes is reduced to reduce the risk of residual copper.

Description

technical field [0001] The present application relates to the technical field of PCB boards, in particular to a method for back-drilling a PCB board and a PCB board. Background technique [0002] At present, as the server is advancing towards high speed and integration, it puts forward higher requirements on the structure of the PCB board with high aspect ratio and high density on the server, and the back drilling process is the corresponding control One of the key processes of signal loss. [0003] Among them, the increase of the thickness-to-diameter ratio of the PCB board will cause a certain loss of hole position accuracy during the through-hole drilling process, which will cause the back-drilled hole and the through-hole to deviate, increasing the risk of residual copper. Moreover, due to the offset between the entry surface and the exit surface of the through hole, the light transmittance is weakened, which also increases the difficulty of accurately obtaining the hol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/0214
Inventor 林淡填廖志强吴杰刘海龙杨中瑞余晋磊
Owner SHENNAN CIRCUITS
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