Processing technique of transparent insulating layer of multi-layer circuit board

Abstract

The invention discloses a processing technique of a transparent insulating layer of a multi-layer circuit board, comprising the following steps: (1) cleaning treatment; (2) drying treatment; (3) painting treatment; and (4) drying treatment of the insulating layer. The traditional epoxy resin prepreg is replaced by high-molecular transparent insulating ink in the processing technique of the transparent insulating layer of the multi-layer circuit board, in this way, the professional can view the inner part of the multi-layer circuit board and estimate the hole offset of drilling, the hole offset abnormality of the drilling process is reduced, and a part of circuit problem can also be checked from the high-molecular transparent insulating material, so that scrapping the material in advance is carried out, the material waste of the subsequent process is reduced, and the materials are supplemented in advance.

Description

technical field [0001] The invention relates to a processing technology of an insulating layer, in particular to a processing technology of an insulating layer of a transparent multilayer circuit board, and belongs to the technical field of electronic component processing. Background technique [0002] During the production process of multilayer circuit boards, multiple circuits and laminations are required. Therefore, the inner circuit part will be laminated to the inside of the multilayer circuit board again. At present, the insulating material used in circuit boards is mainly epoxy The resin is mixed with some inorganic fillers, and its material properties do not have transparency. In the subsequent production process, the interior of the multilayer circuit board cannot be observed. For example, abnormal drilling deviation of the drilled holes, and abnormal opening and short circuit of the inner layer cannot be observed. It is found that technicians cannot make a judgment...

AI Technical Summary

Problems solved by technology

[0002] During the production process of multilayer circuit boards, multiple circuits and laminations are required. Therefore, the inner circuit part will be laminated to the inside of the multilayer circuit board again. At present, the insulating material used in circuit boards is mainly epoxy The resin is mixed with some inorganic fillers, and its material properties do not have transparency. In the subsequent production process, the interior of the multilayer circuit board cannot be observed. For example, abnormal drilling deviation of the drilled holes, and abnormal opening and short circuit of the inner layer circuit cannot be observed. However, technicians cannot make a judgment, and often flow abnormal boards into the next process, and finally form defective products and cause excessive scrapping