Electrostatic protection structure

Abstract

The invention relates to an electrostatic protection structure. The electrostatic protection structure comprises a conductive body and a conductive protrusion, the conductive body surrounds a chip needing to be protected and is grounded, and the conductive protrusion is arranged on the conductive body. According to the electrostatic protection structure, the conductive protrusion is arranged on the conductive body, static electricity can be effectively eliminated in a point discharge mode, a large amount of charges are prevented from being accumulated in the electrostatic protection structure, and therefore the stability and safety of the chip are ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to an electrostatic protection structure. Background technique [0002] The chip can also be called an integrated circuit. With the continuous development of the integrated circuit manufacturing process, the chip packaging density and integration are getting higher and higher, the chip size is getting smaller and smaller, and the interference between circuit modules is becoming more and more obvious. Electrostatic protection appear more important. [0003] The excess charge brought by the ESD (ElectroStatic discharge) phenomenon will be transmitted to the specific circuit through the input and output pins of the specific circuit in a very short period of time, thereby destroying the specific circuit of the chip. [0004] In the current chip packaging layout, a seal ring structure is generally provided around the chip. There is a certain distance between the seal ring ...

AI Technical Summary

Problems solved by technology

However, due to various limitations of the actual process, the smooth conductive lines that make up the protective ring cannot eliminate static electricity well by grounding.

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