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Shell assembly and electronic equipment

A technology of shell components and electronic equipment, which is applied in the direction of electrical equipment shells/cabinets/drawers, casings/cabinets/drawer parts, electrical components, etc., which can solve the problems of reducing product performance and achieve the goal of solving performance Sacrifice, improve comfort, and promote heat dissipation

Active Publication Date: 2021-09-03
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present application aims to provide a housing assembly and an electronic device, at least to solve one of the problems in the prior art that the software-based temperature control strategy solves the problem of temperature rise, resulting in reduced product performance

Method used

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  • Shell assembly and electronic equipment
  • Shell assembly and electronic equipment
  • Shell assembly and electronic equipment

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Embodiment Construction

[0019] Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0020] The features of the terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of these features. In the description of the present application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification ...

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Abstract

The invention discloses a shell assembly and electronic equipment. The shell assembly is used for the electronic equipment; the shell assembly comprises a shell and an electro-deformation part; the outer surface of the shell comprises a first connecting area and a second connecting area, and the first connecting area is connected with the second connecting area; and the electro-deformation part is arranged in the first connecting area. In a first power-on state, the electro-deformation part can at least expand in the thickness direction of the shell, so that the free end of the electro-deformation part protrudes out, and a heat dissipation channel is formed between the electro-deformation part and the outer surface of the shell. The structure of the shell assembly is reasonably arranged, so that the free end of the electro-deformation part is in contact with the palm of a user in the first power-on state. In this way, under the action of the electro-deformation part, natural heat dissipation of the heat dissipation channel is achieved. The heat dissipation channel facilitates air circulation, facilitates improvement of the heat dissipation speed of electronic equipment, can effectively solve the temperature rise problem of the electronic equipment, and does not affect the use performance of a product.

Description

technical field [0001] The present application belongs to the technical field of terminals, and in particular relates to a housing assembly and an electronic device. Background technique [0002] With the wide application of smart phones, the configuration and performance are continuously improved, and various application scenarios such as surfing the Internet, games, videos, photos, and video recordings are very attractive to users, but at the same time, the temperature of smart phones will rise under high load conditions The problem is also of particular concern to users. The temperature rise problem not only affects the performance of mobile phones, but also affects the user experience. [0003] In related technologies, most of the temperature control strategies based on software are used to solve the problem of temperature rise. However, the software-based temperature control strategy does not solve the heat dissipation problem at the root, but at the cost of sacrifici...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K7/20
CPCH05K5/0213H05K5/0017H05K5/0086H05K5/0247H05K5/0204
Inventor 李召辉
Owner VIVO MOBILE COMM CO LTD
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