Bendable anti-collapse flexible flat heat pipe and manufacturing method thereof

Abstract

The invention discloses a bendable anti-collapse flexible flat heat pipe. A heat insulation section is composed of a plurality of heat insulation units wrapped by a rubber shell, and each heat insulation unit is formed by arranging and bonding metal and rubber three-way hole square blocks of the same structure in a staggered mode in the axial direction. Each metal and rubber three-way hole square blocks is provided with an upper cavity, a middle cavity and a lower cavity, the upper cavity and the lower cavity are filled with silk screen liquid absorption core structures to form liquid flow channels, and the middle cavity is a gas flow channel. The invention further provides a manufacturing method of the flat heat pipe. In the manufacturing process, the metal and rubber three-way hole square blocks are machined respectively and are arranged in a staggered and array mode in the axial direction to form the heat insulation units in an adhesive mode, the silk screen liquid absorption core structures are arranged in the upper cavities and the lower cavities of array units in a penetrating and inserting mode,closed cavity bodies are formed through sealed connection, and sealing after vacuumizing and filling a working medium is conducted. The bendable anti-collapse flexible flat heat pipe is simple in structure and convenient to manufacture, has good bending and anti-collapse performance, and is suitable for heat dissipation of flexible electronic devices.

Description

technical field [0001] The invention relates to a bendable and anti-collapse type flexible flat heat pipe and a manufacturing method thereof. Background technique [0002] With the advancement of science and technology, people put forward higher requirements for the functions of electronic systems, which promotes the development of electronic integrated equipment in the direction of miniaturization, integration, and high power. Highly integrated and high-power electronic devices will generate a lot of heat during operation. If the heat cannot be transferred out in time, the temperature of the electronic device will continue to rise, which will directly affect the performance and service life of the device, and even burn out. Heat pipes use phase change heat transfer to achieve high-efficiency heat conduction, providing an ideal solution for heat dissipation and cooling of electronic devices. The heat pipe is composed of an evaporating end, an adiabatic section, and a conden...

AI Technical Summary

Problems solved by technology

At present, most of the heat pipes are rigid structures and cannot be bent freely, or the heat transfer efficiency decreases sharply after bending

Although some

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