Heat conduction double-sided adhesive tape and preparation process thereof

Abstract

The invention relates to adhesive tape, in particular to heat conduction double-sided adhesive tape and a preparation process thereof. The heat conduction double-sided adhesive tape comprises 55-65% of crylic acid glue, 25-35% of heat conduction powder, 4-10% of acetic ether and 2-4% of a curing agent. The heat conduction double-sided adhesive tape is high in heat conduction performance, an electronic component and a circuit board cannot be contaminated, and the heat conduction double-sided adhesive tape can also be used for connection and fixation.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to a heat-conducting double-sided adhesive tape and a preparation process thereof. Background technique [0002] With the densification and miniaturization of integrated circuits, the electronic components become smaller and operate at a higher speed, so the heat dissipation requirements are getting higher and higher. Therefore, in order to dissipate heat from the heat source as soon as possible, We use the high thermal conductivity of the heat dissipation system material to quickly take away the heat to achieve the effect of heat dissipation. [0003] However, there is usually a gap between the heat dissipation system and the surface of the heat-generating part, so that the heat-dissipating system and the surface of the heat-generating part cannot be in complete and close contact, so that the heat dissipation device system cannot achieve complete heat dissipation. [0004] A common correspondin...

AI Technical Summary

Problems solved by technology

[0005] The first type is ceramic heat-conducting adhesive materials, which use ceramic gaskets as heat-conducting materials, mainly flake mica and graphite, etc. When using them, heat-conducting paste needs to be applied on both sides of the heat-conducting sheet to reduce the lack of tight fit between the interfaces. The thermal resistance rises, the disadvantage is that it is easy to break, which is not conducive to die-cutting

[0006] The second type is thermally conductive film, which is made by coating thermally conductive material on glass fiber cloth, using glass fiber cloth as the base material, so that the film has the advantages of high tensile strength and softness, but the disadvantage is that the film is die-cut When the heat conduction material is easy to overflow glue, it will pollute the machine during die cutting

[0007] The third type is thermally conductive adhesive, which is made of liquid or semi-solid thermally conductive adhesive by adding ceramic powder, graphite or metal powder to liquid polymer. The advantages of this type of material are low thermal resistance and good heat transfer effect. It is easy to contaminate electronic components and circuit boards when used, and it will dry and volatilize into small molecular substances under constant high temperature