Phase change support for LED three-dimensional packaging and manufacturing method thereof

Abstract

The invention discloses a phase change support for LED three-dimensional packaging and a manufacturing method thereof. The phase change support for the LED three-dimensional packaging comprises a support base and a copper pipe. Am open pore is formed in the center of the support base, a stepped hole is formed in the front end of the open pore, the bottom surface of the open pore is away from the bottom surface of the base by 3-8mm, and the copper pipe is inserted into the stepped hole of the open pore and connected with the support base through welding in a sealed mode; integrally connected imbibitions cores are formed in the inner wall of a cavity formed by the support base and the copper pipe and the inner wall of the copper pipe in a sintering mode, and liquid working media are filled in the cavity formed by the support base and the copper pipe; the liquid working media are purified water or acetone or methyl alcohol or ethyl alcohol; the lower end of the support base is of a polyhedral prismoid structure, and prismatic surfaces of the polyhedral prismoid are LED chip installation surfaces. The phase change support can achieve LED multi-chip high density integrated packaging, is high in luminous efficiency and strong in capacity of heat transmission, can effectively reduce LED operating temperature, and prolongs service life. In addition, the manufacturing process is simple and feasible, cost is low, and industrialization is easily achieved.

Description

technical field [0001] The invention relates to a phase-change support for LEDs, in particular to a phase-change support for three-dimensional packaging of LEDs and a manufacturing method thereof. Background technique [0002] LED (Light Emitting Diode) is called a light-emitting diode, which is a semiconductor electronic component that can emit light after being energized. LED has three major advantages of energy saving, environmental protection and long life. Compared with traditional incandescent lamps, it can save 60% to 90% of electric energy. It is recognized as the next generation of green light sources. It is gradually replacing traditional light sources and penetrating into people's daily life. . [0003] At present, LED packaging devices are developing in the direction of multi-chip integrated packaging. However, the general multi-chip light source is mostly a planar integrated light source, with low chip packaging density and small light output angle. In additio...

AI Technical Summary

Problems solved by technology

However, the multi-chip packaging device module will generate more heat, which will cause the LED junction temperature to rise, resulting in a serious decrease in LED luminous efficiency and affecting its working life.

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