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Earphone and mobile terminal

A headphone, cutting-edge technology, applied in the field of headphones and mobile terminals, can solve the problems of inconsistent acoustic performance, leakage sound volume, and suboptimal sound quality of users, etc.

Pending Publication Date: 2022-03-01
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Semi-in-ear headphones usually do not seal in the ear canal, but the sound quality may not be optimal for the user as sound can leak from the earphones and not reach the ear canal
In addition, due to different ear shapes and sizes, different sound volumes may leak, resulting in inconsistent acoustic performance among users, affecting user experience

Method used

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  • Earphone and mobile terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Based on the above-mentioned embodiments, Embodiment 1 of the present application discloses an earphone 300 , including a housing 310 for carrying components and cables of the earphone 300 , for example, the components may include a speaker assembly. The housing 310 contains a front cavity and a rear cavity separated by the speaker assembly, wherein the front cavity is located on one side of the sound output direction of the speaker assembly, and the rear cavity is located on the opposite side of the speaker assembly sound output direction. The structure of the above speaker assembly , and the front cavity and the rear cavity divided by the speaker assembly are a conventional setting of the earphone 300 , which will not be described in detail here.

[0051] For the outer surface of the housing 310, the housing 310 has a snapping area 312 for snapping into the user's ear canal. It should be understood that although image 3 The middle engaging area 312 is replaced by a ...

Embodiment 2

[0074] Based on the foregoing embodiments, this embodiment introduces another implementation form of the sound guide channel. see Figure 5 , which is a structural schematic diagram of another earphone provided in the embodiment of the present application, Figure 5 Part of the labels in can refer to image 3 same label in . Figure 5 The sound guiding channel of the earphone shown is a groove 323 , that is, at least one of the one or more sound guiding channels is a groove 323 provided on the outer surface of the housing 310 . One end opening of the groove 323 communicates with the air in the ear canal when the earphone 300 is normally worn; the other end of the groove 323 communicates with the air outside the ear canal when the earphone 300 is normally worn. When specifically configured, the groove 323 is disposed on the outer surface of the housing 310 (the surface of the housing 310 facing the ear canal), and extends from the tip region 313 of the housing 310 to the mai...

Embodiment 3

[0079] Based on the foregoing embodiments, this embodiment introduces another implementation form of the sound guide channel. see Figure 6 , is a schematic structural diagram of an earphone provided in an embodiment of the present application. Figure 6 Part of the labels in can refer to image 3 same label in . Figure 6 The sound guiding channel shown takes the form of a combination of grooves 324 and through holes 325 . The through hole 325 communicates with the groove 324 to form a sound guiding channel. At this time, at least one sound guiding channel among the one or more sound guiding channels includes a first channel group and a second channel group. The first channel group includes at least one first channel, such as one, two or three first channels; wherein, the first channel is a groove 324 provided on the outer surface of the casing. The second channel group includes at least one second channel, such as one, two, or three second channels; wherein, the second ...

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PUM

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Abstract

The invention provides an earphone and a mobile terminal, and the earphone comprises a housing and a loudspeaker assembly, the interior of the housing comprises a front cavity and a rear cavity which are separated by the loudspeaker assembly, the front cavity is located at one side of the sound production direction of the loudspeaker assembly, and the rear cavity is located at one side opposite to the sound production direction of the loudspeaker assembly; the shell is provided with one or more sound guide channels, each sound guide channel is arranged on the side wall of the shell, and each sound guide channel is used for communicating air in an ear canal of a user with air outside the ear canal under the condition that the air in the front cavity and the air in the rear cavity are not communicated when the earphone is normally worn. When the scheme is adopted, the environment in the ear canal is communicated with the environment outside the ear canal through the sound guide channel arranged in the shell, so that the sound pressure in the ear canal can be exposed or discharged to the surrounding environment outside the earphone. The pressure in the ear canal is reduced; and the sound experience of the user is improved.

Description

[0001] This application claims the priority of a Chinese patent application with application number 202010900041.1 and application title “A Headphone and Mobile Terminal” submitted to the China Patent Office on August 31, 2020, the entire contents of which are incorporated in this application by reference. technical field [0002] The present application relates to the technical field of communication, and in particular to an earphone and a mobile terminal. Background technique [0003] Whether listening to MP3 players while traveling or listening to high-fidelity stereo systems at home, consumers are increasingly choosing in-ear and semi-in-ear headphones for their listening enjoyment. Both types of electro-acoustic transducer devices have a relatively thin housing containing the receiver or driver (earpiece speaker). The thin housing provides convenience for the user while also providing great sound quality. Among them, the semi-in-ear earphone is generally adapted in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10
CPCH04R1/1016H04R1/1091
Inventor 宋贤高吴融融吉成霞郑勇李正学
Owner HUAWEI TECH CO LTD
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