Automatic chip detection method and device

Abstract

The invention provides an automatic chip detection method and device, and the method comprises the steps: carrying out the silk-screen ID detection, appearance detection and performance detection in a process that a manipulator moves a tray from a feeding region to a discharging region; the method comprises the following steps: obtaining a screen printing ID through screen printing ID detection, and obtaining a chip ID during a performance test; then the silk-screen ID and the chip ID are combined to lock a specific chip, that is, the bound silk-screen ID and chip ID can be used as the unique identity of the chip, so that the appearance detection result and the performance test result of the chip can be integrated based on the unique identity of the chip; a user or a detection manager can conveniently and quickly know the overall condition of a specific chip, and the classification result is more accurate.

Description

technical field [0001] The invention relates to the technical field of detection, in particular to a chip automatic detection method and device. Background technique [0002] The domestic semiconductor industry started relatively late, and the appearance inspection and performance testing of chip products are usually performed manually, which requires a lot of manpower and man-hours, and is likely to cause secondary pollution and damage during inspection. Moreover, the appearance inspection and performance test of the chip are usually two independent lines, and it is difficult to realize the correlation and fusion of the inspection data of the two. Therefore, with the traditional chip detection method, even after the entire chip detection process is completed, it is impossible to quickly obtain the overall detection data of a single chip to be inspected, and it is impossible to accurately classify the chips to be inspected. Contents of the invention [0003] Based on the ...

AI Technical Summary

Problems solved by technology

[0002] The domestic semiconductor industry started late, and the appearance inspection and performance testing of chip products are usually performed manually, which requires a lot of manpower and man-hours, and it is easy to cause secondary pollution and damage during the inspection.

Moreover, the appearance inspection and performance test of the chip are usually two independent lines, and it is difficult to realize the correlation and fusion of the inspection data of the two.

Therefore, with the traditional chip detection method, even after all the chip detection processes are completed, it is impossible to quickly obtain the overall detection data of a single chip to be inspected, and it is impossible to accurately classify the chips to be inspected

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