Preparation method of negative tab with surface inert metal coating and lithium battery
A technology of inert metals and negative tabs, which is applied to secondary batteries, battery pack components, circuits, etc., can solve problems such as liquid leakage and nickel plating, and achieve simple preparation methods and improved durability and reliability. , the effect of easy surface performance
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Embodiment 1
[0029] (1) Substrate pretreatment: The surface of the substrate is cleaned with a NaOH solution with a pH of 10, and then the substrate is acid washed with a HCl solution with a pH of 3. After cleaning and drying, the substrate is subjected to a number of possible treatments to refine the surface grains to obtain The surface roughness of the substrate is Ra0.3, and the grain size grade is 10;
[0030] (2) Nickel plating layer: the surface of the base material obtained in step (1) is electroplated with nickel by electrochemical method, cleaned and dried, and then the surface tensile stress is removed with Haoke energy to obtain a nickel-plated base material with a surface roughness of Ra0.3 , with a thickness of 5 μm;
[0031] (3) Inert metal coating: Immerse the nickel-plated substrate obtained in step (2) in a mixed solution of vitamin C, polyvinylpyrrolidone and chloroauric acid with a molar concentration ratio of 0.1:0.02:0.5, and react at 50°C for 100 min , cleaned and dr...
Embodiment 2
[0034] (1) Substrate pretreatment: The surface of the substrate is cleaned with a NaOH solution with a pH of 10, and then the substrate is acid washed with a HCl solution with a pH of 3. After cleaning and drying, the substrate is subjected to a number of possible treatments to refine the surface grains to obtain The surface roughness of the substrate is Ra0.1, and the grain size grade is 12;
[0035] (2) Nickel-plated layer: the surface of the substrate obtained in step (1) is plated with nickel by electrochemical method, cleaned and dried, and then the surface tensile stress is removed with Haoke energy to obtain a nickel-plated substrate with a surface roughness of Ra0.1 , with a thickness of 5 μm;
[0036] (3) Inert metal coating: Immerse the nickel-plated substrate obtained in step (2) in a mixed solution of vitamin C, polyvinylpyrrolidone and chloroauric acid with a molar concentration ratio of 0.1:0.02:0.5, and react at 50°C for 100 min , cleaned and dried, and then th...
Embodiment 3
[0039] (1) Substrate pretreatment: The surface of the substrate is cleaned with a NaOH solution with a pH of 10, and then the substrate is acid washed with a HCl solution with a pH of 3. After cleaning and drying, the substrate is subjected to a number of possible treatments to refine the surface grains to obtain The surface roughness of the substrate is Ra0.5, and the grain size grade is 10;
[0040] (2) Nickel-plated layer: the surface of the base material obtained in step (1) is electroplated with nickel by electrochemical method, cleaned and dried, and then the surface tensile stress is removed with Haoke energy to obtain a nickel-plated base material with a surface roughness of Ra0.5 , with a thickness of 5 μm;
[0041] (3) Inert metal coating: Immerse the nickel-plated substrate obtained in step (2) in a mixed solution of vitamin C, polyvinylpyrrolidone and chloroauric acid with a molar concentration ratio of 0.1:0.02:0.5, and react at 50°C for 100 min , cleaned and dri...
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