Unlock instant, AI-driven research and patent intelligence for your innovation.

Ink jet head substrate, ink jet head, and method of manufacturing an ink jet head substrate

一种喷墨头、衬底的技术，应用在喷墨头衬底,制造该喷墨头衬底领域，能够解决难以均匀加热喷墨头衬底、难以控制喷墨头衬底温度等问题

Inactive Publication Date: 2006-01-25
SAMSUNG ELECTRONICS CO LTD
View PDF2 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it may be difficult to uniformly heat the entire inkjet head substrate, and in particular, it may be difficult to control the temperature of the inkjet head substrate in the ink ejection region where ink is actually ejected.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ink jet head substrate, ink jet head, and method of manufacturing an ink jet head substrate
  • Ink jet head substrate, ink jet head, and method of manufacturing an ink jet head substrate
  • Ink jet head substrate, ink jet head, and method of manufacturing an ink jet head substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] The invention will now be described with reference to embodiments of the present general inventive concept, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. The embodiments are described below in order to describe the present general inventive concept by referring to the figures.

[0035] figure 1 is a plan view of an inkjet head according to an embodiment of the present general inventive concept, and figure 2 yes figure 1 An enlarged plan view of portion R1 of the ink ejection zone is shown. also, Figure 3A yes figure 1 An enlarged plan view of the section heater H shown. Figures 5 to 9 is a sectional view illustrating a method of manufacturing an inkjet head according to an embodiment of the present general inventive concept. exist Figures 5 to 9 , area "A" is shown along the ink ejection area of ​​the figure 2 A cross-sectional view of the inkjet head substrate taken on lin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides an ink jet head substrate, an ink jet head and a method of manufacturing an ink jet head substrate are provided. The ink jet head substrate includes a substrate having an ink ejection region. An interlayer insulating layer is formed on the substrate. A plurality of pressure-generating elements that generate pressure to eject ink are disposed on the interlayer insulating layer to form a predetermined array. Segment heaters that heat the substrate are disposed at predetermined positions on the substrate. The segment heaters are electrically connected to each other by heater wirings.

Description

technical field [0001] The present general inventive concept relates to an inkjet head substrate, an inkjet head, and a method of manufacturing the inkjet head substrate, and more particularly to an inkjet head substrate equipped with a plurality of segment heaters for heating substrates. Inkjet head substrate, inkjet head equipped with the inkjet head substrate, and method of manufacturing the inkjet head substrate. Background technique [0002] Generally, a thermal inkjet head uses a plurality of heat-generating resistors on a substrate as electrothermal transducers to generate bubbles by instantaneously heating ink, thereby ejecting ink droplets from the inkjet head. The plurality of heat generating resistors are located in ink chambers in which ink is temporarily stored before heating. The ink in the ink chamber is ejected onto the recording medium by the pressure generated by the heating resistor through the nozzle, which is in fluid communication with the ink chamber....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/045B41J2/135B41J2/16B41J2/01
CPCB41J2/04563B41J2/0458B41J2/14153B41J2/14129B41J2/14072B41J2/16526B41J2/164
Inventor 白五贤
Owner SAMSUNG ELECTRONICS CO LTD