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Components of heat radiation medium

A heat-dissipating medium and proportional technology, applied in the field of heat-dissipating medium components, can solve the problems of poor conduction and heat-dissipation, the heat-dissipating medium cannot meet the requirements, and the conduction function cannot be exerted, and achieves the effect of the best heat-dissipation and conduction effect.

Inactive Publication Date: 2007-04-11
源贸兴业有限公司
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Problems solved by technology

[0003] Although the above-mentioned commonly used heat dissipation medium can be applied to the position of the required heating component to achieve the effect of conduction heat dissipation, the main component of the heat dissipation medium is only silica gel (main rubber) and bridging agent. As a result, its conduction and heat dissipation characteristics are poor. Therefore, when it is applied to electronic heating components that require fast conduction and heat dissipation, it is less able to perform the required conduction function.
Therefore, the heat dissipation medium made by the above-mentioned method cannot meet the requirements of actual use.

Method used

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  • Components of heat radiation medium

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Embodiment Construction

[0020] Please refer to FIG. 1 , which is a schematic diagram of the production process of the present invention. As shown in the figure: the composition of a heat dissipation medium of the present invention, the heat dissipation medium 1 is formed by mixing and stirring a first material 2 and a second material 3 with a rubber mixing mixer, wherein the first material 2 is Silicone 21 and silicone oil 22 are first mixed, and then mixed with non-conductive chemical powder 23 evenly. In the first material 2, the proportion of silicon 21 and silicone oil 22 after mixing is 50%. The non-conductor The proportion of the chemical powder 23 is 50%, and the proportion of the silicon 21 and the silicone oil 22 is 5.42 to 1. In addition, the non-conductive chemical powder 23 is a hexagonal crystal with edible properties and good heat dissipation, white graphite and and the second material 3 is formed by uniformly stirring and mixing silica gel 31 and bridging agent 32, wherein the bridging...

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Abstract

The present invention is one kind of heat radiating medium, which is one kind of non-solid medium with homogeneously mixed first material and second material. The first material is prepared through mixing silicon and silicone oil and further mix with non-conductor compound powder; and the second material is prepared through mix silica gel and bridging agent. The heat radiating medium is used in various kinds one conductor junction to reach excellent heat conducting dissipation effect.

Description

technical field [0001] The invention relates to a heat dissipation medium, in particular to a composition of the heat dissipation medium which can make the conductor have a better heat dissipation conduction effect. Background technique [0002] Generally, silica gel is used as the main glue in the commonly used heat dissipation medium at present, and then a bridging agent is added to the main glue during production to mix and stir evenly to make a heat dissipation medium, which can make the heat dissipation medium be applied to the position of the required electronic heating component , connect the heat dissipation conductor, and achieve the effect of conduction heat dissipation. [0003] Although the above-mentioned commonly used heat dissipation medium can be applied to the position of the required heating component to achieve the effect of conduction heat dissipation, the main component of the heat dissipation medium is only silica gel (main glue) and bridging agent. As...

Claims

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Application Information

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IPC IPC(8): C09K5/08
Inventor 林磊祥
Owner 源贸兴业有限公司