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Heat sink

Inactive Publication Date: 2013-03-07
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention helps to direct the airflow from a fan in a heat sink or electronic device, preventing the airflow from bumping into the connecting piece of the heat sink and maintaining a sufficient wind pressure. It also helps to push the airflow flowing between the air guide fins and circulate the air around the heat sink, achieving a good heat dissipation effect.

Problems solved by technology

If an electronic device in operation can't effectively dissipate the heat, the accumulated heat will adversely affect the electronic device itself and the operation speed.
Moreover, when the temperature of the electronic device increases to a certain level, the operation thereof becomes unstable, or even the electronic device breaks down.
Therefore, for an electronic device usually producing a lot of heat, the heat-dissipation efficiency thereof is particularly an important issue.
This results in a turbulent flow between the heat dissipation fins, increased air resistance, and decreased heat dissipation efficiency.

Method used

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first embodiment

[0025]As shown in FIG. 1, the heat sink 100 of the present invention includes a connecting piece 110 and a plurality of air guide fins 120. The connecting piece 110 and the plurality of air guide fins can be, but not limited to the metal sheets or metal plates made of aluminum or copper for example. The plurality of air guide fins 120 are arranged to “stand” (erect) on the connecting piece 110 at intervals and may be formed integrally by extending from the connecting piece 110. Alternatively, the air guide fins 120 may be formed separately on the connecting piece 110 at intervals through soldering, welding or the like. Each air guide fin 120 is provided with two guiding faces 121 at the side away from the connecting piece 110. Besides, the two guiding faces 121 are located at the two opposite sides of the air guide fin 120 obliquely with respect to the connecting piece 110. For example, the guiding face 121 may be a curved surface or an inclined plane.

[0026]Referring to FIGS. 1-2, t...

second embodiment

[0029]As shown in FIGS. 4 and 5, the heat sink 100 of the present invention includes a connecting piece 110, a plurality of air guide fins 120 and a plurality of heat dissipation fins 130 which may be (but not limited to) metal sheets or metal plates composed of for example aluminum or copper. In this embodiment, the air guide fins 120 are made of copper, while the heat dissipation fins 130 are made of aluminum. However, it should be appreciated that the present invention is not limited thereto. The plurality of air guide fins 120 are spaced apart sequentially and erect on the connecting piece 110. Also, the air guide fins 120 may be formed integrally or separately with the connecting piece 110. Moreover, each air guide fins 120 has two guiding faces 121 at the sides away from the connecting piece 110. The two guiding faces 121 are oblique with respect to the connecting piece 110 and located at two opposite sides of the air guide fin 120. As an exemplary aspect, the guiding face 121...

fourth embodiment

[0036]Referring to FIGS. 9 and 10, the heat sink 100 of the present invention includes a connecting piece 110, a plurality of air guide fins 120 and a plurality of heat dissipation fins 130, in which the connecting piece 110 is in the form of a cylinder, and the heat dissipation fins 130 are arranged annularly on the connecting piece 110 at intervals so that an airflow channel 131 is formed between two adjacent heat dissipation fins 130. Particularly, the heat dissipation fins 130 may be formed integrally with the connecting piece 110 or joined to the connecting piece 110 by soldering or welding for example, while this is not a limitation to this invention. Furthermore, the heat dissipation fins 130 may be, but not limited to the metal sheets or metal plates of aluminum or copper, and the air guide fins 120 may be, but not limited to metal sheets or metal plates of aluminum or copper or plastic plates for example.

[0037]Each of the plurality of air guide fins 120 is disposed detachab...

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PUM

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Abstract

Disclosed is a heat sink in cooperation with a fan. The heat sink includes a connecting piece and plural air guide fins disposed on the connecting piece at intervals and each having a guiding face thereon. The guiding face functions to direct the airflow generated by the fan from a first axial direction to a second axial direction, thereby improving greatly the heat dissipation efficiency.

Description

CROSS-REFERENCE OF RELATED APPLICATIONS[0001]This application claims the benefit of the filing date of Taiwan Patent Application No. TW 100131835, entitled “Heat Sink” and filed on Sep. 2, 2011, which is incorporated herein in its entirety by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a heat sink, especially to a heat sink with a guiding face.[0004]2. Description of Related Art[0005]Most of the electronic devices such as central processing units (CPU), graphic processing units (GPU) and memory devices generate heat during data processing. If an electronic device in operation can't effectively dissipate the heat, the accumulated heat will adversely affect the electronic device itself and the operation speed. Moreover, when the temperature of the electronic device increases to a certain level, the operation thereof becomes unstable, or even the electronic device breaks down. Therefore, for an electronic device usually pro...

Claims

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Application Information

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IPC IPC(8): F28D15/00
CPCH01L23/4006H01L23/467H01L2924/0002H01L2924/00
Inventor MAO, TAI CHUAN
Owner GIGA BYTE TECH CO LTD