Sub-rack with housing for receiving plug-in modules
a plug-in module and sub-rack technology, applied in the direction of containers/bottles, rigid containers, containers, etc., can solve the problems of increasing power consumption of electronic plug-in modules today, difficult construction of cooling transfer points to contact insertable and removable plug-in modules with electronic components, and relatively complicated overall construction, so as to achieve the effect of increasing cooling efficiency
Inactive Publication Date: 2007-11-08
SCHROFF GMBH
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- Abstract
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Benefits of technology
[0009]According to the invention, simple retrofitting of such a distributor on the sub-rack is allowed by this construction. If individual plug-in modules are replaced and if there is a need for liquid cooling for these replaced modules, a liquid distributor can be easily arranged on the outside of the sub-rack. For an arrangement in the front region, there is also the advantage that the liquid distributor is easily accessible. First, the feed line and the return line to the heat sink can be easily coupled and fixed to the liquid distributor on the plug-in module. In this way, sub-racks installed in switchgear cabinets can be easily expanded. The sub-rack need not be removed from the switchgear cabinet to subsequently install a cooling device for the plug-in modules.
[0017]It is further advantageous to provide combined air and liquid cooling. In addition to the (standard) device for air cooling, a cooling device for liquid cooling is also provided. This allows the cooling of “hot spots,” that is, especially hot zones. Plug-in modules can be cooled separately or selectively according to the individual requirements of cooling. For expanding an air cooled sub-rack by liquid cooling, the liquid cooled plug-in module is also still cooled by air cooling, so that the cooling efficiency is increased.
Problems solved by technology
The power consumption of electronic plug-in modules today continues to increase.
This arrangement, however, has a difficult construction of the cooling transfer points to the insertable and removable plug-in modules with their electronic components to be contacted.
Disadvantages include a relatively complicated overall construction and likewise heat transfer that is difficult to implement.
Subsequent installation in an air cooled sub-rack is not possible or is possible only with much difficulty.
Method used
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[0025]In the description which follows like parts are marked throughout the specification and drawings with the same reference numerals, respectively. The drawing figures may not be to scale and certain features may be shown in somewhat schematic or generalized form in the interest or clarity and conciseness.
[0026]FIGS. 1, 2, and 3 each show a sub-rack 1 with a housing 2, into which plug-in modules 3 are pushed. In the front region 4 of the sub-rack 1, a front cover plate 5 is provided above a push in area 6, which area is for inserting and removing the plug-in modules 3. Underneath the push in area 6 there is an air inlet plate 7, which has a screen-like construction, so that several small air inlet openings are provided for air-cooling the sub-rack 1.
[0027]In FIG. 1, the two plug-in modules 3 each have two through-holes 9 on their front plates 8. Cooling fluid feed lines 10 and return lines 11 of a cooling device for liquid cooling are guided through the through-holes 9, see FIG. ...
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A sub-rack (1) for plugging and unplugging electronic plug-in modules (3) includes a housing (2) which has a front cover plate (5). Each plug-in module includes a cooling device including a heat sink (19). A liquid distributor (12) is mounted on the cover plate and in flow connection with each of the heat sinks via a feed line (10) and a return line (11), and the liquid distributor is arranged on the outside of and in the front region (4) of the sub-rack.
Description
BACKGROUND OF THE INVENTION[0001]The present invention pertains to a sub-rack for plugging and unplugging electronic plug-in modules with a housing, which has a front cover plate and a cooling device for the plug-in modules.[0002]The power consumption of electronic plug-in modules today continues to increase. In connection with the power consumption, waste heat or the thermal output also increases. For a few modules, special cooling devices must be provided, with which the plug-in module is cooled by means of liquid cooling.[0003]From German patent publication DE 102 10 480 A1, a housing with electronic modules is known, in which a rigidly installed cooling plate carrying a liquid flow is allocated to each module. This arrangement, however, has a difficult construction of the cooling transfer points to the insertable and removable plug-in modules with their electronic components to be contacted.[0004]German patent publication DE 43 27 444 A1 describes a cooling device for a switchge...
Claims
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CPCA45B9/02H05K7/20645H05K7/20636A45B25/12
InventorHERRMANN, RALFJOIST, MICHAELKEMPF, HEINZPAWLOWSKI, ADAMRHEINSCHMITT, LIANE
OwnerSCHROFF GMBH