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Internal and external connecting liquid cooled heat sink device

a liquid cooled heat sink and internal connection technology, which is applied in the direction of heating and refrigeration combinations, refrigeration machines, instruments, etc., can solve the problems of poor heat dissipation effect, inability to realize positional variation according to users, and inconvenient disorder of component members, etc., to achieve optimal heat dissipation

Inactive Publication Date: 2008-02-14
CHEN WEN HAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]The art of the present invention provides an internal and external connecting liquid cooled heat sink device, which embodies a variation in a liquid cooled exchange device structure of a heat dissipating unit, wherein a plurality of through holes perforate each heat dissipating fin of the liquid cooled heat sink device, and the circulating heat conduction function of the plurality of through holes enables the heat dissipating unit within a holding case to achieve optimum heat dissipation effectiveness.

Problems solved by technology

1. Planarity of heat dissipating fins results in a poor dissipating effect,
2. Occupies space when installed and the disorder of component members is inconvenient when set up.
3. Unable to realize positional variation according to user needs.

Method used

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  • Internal and external connecting liquid cooled heat sink device
  • Internal and external connecting liquid cooled heat sink device
  • Internal and external connecting liquid cooled heat sink device

Examples

Experimental program
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Embodiment Construction

[0018]Referring to FIGS. 3, 4 and 5, which show an internal and external connecting liquid cooled heat sink device comprising a liquid cooled heat sink device B primarily structured to comprise a holding case C, a water tank facility D, a heat dissipating unit E, pipes F and a water cooled head G.

[0019]The water tank facility D and the heat dissipating unit E are disposed interior of the holding case C and connected in series using the pipes F. A hydraulic pump D1 causes a liquid within the water tank facility D to pass through the pipes F to a water cooled head G to dissipate heat, and the water cooled head G further causes the liquid to pass through the pipes F to the heat dissipating unit E. The heat dissipating unit E further comprises a liquid cooled exchange device El that abstracts heat from the liquid in the pipes F, whereafter the cooled liquid is transported to the water tank facility D through the pipes F. The aforementioned configuration thus forms the liquid cooled heat...

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PUM

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Abstract

The present invention provides an internal and external connecting liquid cooled heat sink device, which includes a holding case, a water tank facility, a heat dissipating unit, pipes and a water cooled head. The holding case retains the water tank facility and the heat dissipating unit connected in series using the pipes. The pipes are connected to a water cooled head to enable circulating and dissipating of heat. The holding case can be removable inserted into a retaining slot of a host computer or independently connected to an outer case of the host computer. Moreover, a plurality of through holes are defined in each heat dissipating fin of a liquid cooled exchange device, thereby enabling the heat dissipating unit to effectively achieve increased heat dissipation effectiveness when circulating and dissipating heat.

Description

BACKGROUND OF THE INVENTION[0001](a) Field of the Invention[0002]The present invention relates to an Internal and external connecting liquid cooled heat sink device, which embodies a variation in a liquid cooled exchange device structure of a heat dissipating unit.[0003](b) Description of the Prior Art[0004]Referring to FIGS. 1 and 2, which show a heat dissipating system A of prior art, wherein a water tank A1, a heat sink A2, fans A3, a motor A4 and a cooling plate A5 are mutually connected in series using a water pipe A6. However, the heat dissipating system A occupies space when installed to a host computer A7, and disorder of component members when set up is a cause for annoyance when.[0005]Furthermore, the heat dissipating effect of the prior art heat sink A2 is realized by mutually connected heat dissipating fins A8 of the heat sink A2 dissipating a heat source, wherein structure of the heat dissipating fins A8 is planar. However, using planarity of the heat dissipating fins A...

Claims

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Application Information

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IPC IPC(8): F25B29/00
CPCG06F2200/201G06F1/20
Inventor CHEN, WEN-HAN
Owner CHEN WEN HAN