34results about How to "Heat dissipating structure" patented technology

An assembled electromagnetic shielding case conducive to electromagnetic interference shielding and heat dissipation of an electronic component on a printed circuit board includes a body, a shielding element, and a fixing element. The body has an opening and an engagement portion. The engagement portion connects the body and the printed circuit board. The shielding element has a bottom side and a heat-dissipating side opposing thereto. The shielding element closes the opening for effectuating electromagnetic interference shielding. The shielding element dissipates heat generated from the electronic component by transferring the heat from the bottom side to the heat-dissipating side for dissipating the heat. The fixing element couples the body and the shielding element. Accordingly, with the assembled electromagnetic shielding case, not only is the electronic component insusceptible to electromagnetic interference and easy to change, but it is feasible to provide highly efficient heat dissipation and a miniaturized heat dissipation structure.

A protective case with multiple air tunnels for the protective case, so the heat absorbed by contact blocks from the electronic equipment is radiated rapidly out of the protective case through vent pipes. When the electronic equipment is supported up to watch movie or play games, because the hot air will raise and be exhausted from the upper part, and the fresh cool air will come inside from lower part of the protective case, as a result, the ventilation is accelerated and the heat dissipation performance is greatly improved.

A heat dissipating structure and a semiconductor package with the same are proposed. A substrate is used to accommodate at least one chip thereon, and the chip is electrically connected to the substrate. A heat dissipating structure having a flat portion and a support portion is mount on the substrate via the support portion by means of an adhesive. At least one groove is formed on the support portion and at least one air vent is formed around the groove to allow the groove to communicate with the outside via the air vent, such that the adhesive is allowed to fill the groove to expel air from the groove to the atmosphere through the air vent, thereby preventing the air from trapped in the groove.

A heat dissipation structure in which an IC chip that generates heat is mounted on a substrate and a heat dissipation sheet is interposed between a cover member and the IC chip to dissipate heat, wherein chip-pressing parts (5) are provided to a cover member (4), so that IC chips (3) are pressed against heat dissipation sheets (1) by the chip-pressing parts (5), and each chip-pressing part (5) is configured from an elastic pressing part equipped with an elastically deformable elastic section (51), and a contact section (52) that comes into contact with a heat dissipation sheet (1), in order to provide an electronic device heat dissipation structure that exhibits sufficient heat dissipation properties and improves the reliability of the electronic device, and has a structure such that it is possible to reliably interpose a heat dissipation sheet between an IC chip and a cover member.

A battery device is provided, which includes a fixing frame, a battery and a heat dissipating structure. The fixing frame includes a first plane, a second plane and a third plane. The first plane stands apart from the second plane, and the third plane connects the first plane and second plane. A receiving space is formed between the first and the second planes. The battery is disposed in the receiving space. The heat dissipating structure includes a plate and a block connected to the plate. The plate is disposed on the second plane and comes into contact with the battery. The block is disposed on the third plane and has an input hole and an output hole for liquid to pass therethrough. With this arrangement, the heat dissipating structure can quickly dissipate heat from the battery by the liquid flow. A battery device module is also provided in this disclosure.

A heat-dissipating structure for a flat panel display comprises a heat-collector plate, a soft thermal-pad and at least one heat-sink component. The heat-collector plate is made of metal material having a first-face, a second-face and a plurality of edge-sides. The first-face is contact with a back-bezel of the flat panel display. The soft thermal-pad is made of soft material with high thermal conductivity. The soft thermal-pad has a bottom-face and a top-face. The bottom-face is contact with the second-face. The top-face is contact with a heat-sink structure of an electric unit of the flat panel display. The heat-sink component is connected with at least one of the edge-side of the heat-collector plate. The heat-sink component is capable of conducting heat and expanding heat sink area.

A light-emitting diode (LED) filament with a heat-dissipating structure includes multiple LED chips, multiple conductive carriers and a package layer. Each conductive carrier takes the form of a metal sheet and the multiple conductive carriers are spaced apart from each other. Each LED chip is commonly carried by and is electrically connected to two of the multiple conductive carriers adjacent to the LED chip. The package layer covers the multiple LED chips and the multiple conductive carriers with two lateral edge portions of each conductive carrier exposed from the package layer. The LED filament is mounted inside a light bulb. Because the multiple conductive carriers are partially exposed from the package layer, heat generated by the multiple LED chips can be dissipated to an ambient environment without affecting lighting efficiency and light output as a result of accumulated heat.

A heat dissipating structure for a computer casing includes a computer casing having a front board, a back board, and a bottom board, wherein the front board and the back board are parallel and correspond to each other by being connected together on the bottom board. There are two supporting frames mounted at an opposite side corresponding to the bottom board for respectively connecting with the upper sides of the front board and the back board so as to form a rectangular hexahedron. There are plural placing slots mounted on the front board for placing a disk drive, a CD-ROM drive, and plural connectors therein, wherein the front board further has the plural heat dissipating openings mounted thereon between the positions of the placing slots. Through the heat dissipating openings, the air flowing outside is drawn into the inside computer casing so that the heat generated by the electrical elements can be exhausted to the outside and a better heat dissipating effectiveness is achieved.

An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

A monitor supporting device for vehicle includes a control panel having a chamber formed by an inner peripheral surface, for receiving a housing and for detachably attaching the housing to the control panel with catches and protrusions. The housing includes a front recess formed by a partition for receiving an electronic device, and includes a rear space located behind the partition, and includes one or more orifices formed in the partition and communicating with the rear space of the housing, for forming an air passage and for air circulating and heat dissipating purpose, and for preventing the electronic device from over-heating, and thus for allowing the working life of the electronic device to be increased.

The invention relates to a printed circuit board (PCB) with a heat dissipating structure. The PCB comprises a conducting layer and a PCB carrier layer, wherein the PCB carrier layer is a porous heat conducting layer; heat conducting liquid or a solid-liquid phase change heat conducting material is injected into holes of the porous heat conducting layer; the conducting layer is arranged on a first surface of the porous heat conducting layer; and a second surface of the porous heat conducting layer is a contact interface with external media. In the invention, the carrier layer of the PCB is a porous heat conducting layer which is made of a porous material with high thermal conductivity, heat conducting liquid such as heat conducting ink or the solid-liquid phase change heat conducting material permeates into the holes of the porous heat conducting layer; when the PCB is heated, the heat conducting ink is separated out of the porous material because the expansion coefficient of the porous material is inconsistent with that of the heat conducting ink, and the separated heat conducting ink fills air gaps between the contact interface and the external medium in the contact interface of the PCB via capillary phenomenon, so that heat resistance between a light-emitting diode (LED) and the contact interface is reduced greatly and the thermal conductivity of the PCB is enhanced; moreover, the PCB has low cost, simple structure and easy installation.

A flashlight assembly includes a head portion having a receiving space, a light assembly received in the receiving space, and a radiator. The radiator is received in the receiving space and abuts against the light assembly. The radiator has an inner surface and an outer surface both defined therein. The inner surface has a protrusion extended therefrom. The protrusion abuts against the light assembly. Heat generated by the light assembly is conducted to the radiator via the protrusion and dissipated from the outer surface.

A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.

Provided are a heat dissipation structure for a display panel, and a manufacturing method and an application thereof. The heat dissipation structure includes a copper foil layer and a heat conducting layer disposed on the copper foil layer; wherein a material of the heat conducting layer includes a heat conducting material having a three-dimensional structure, and a gap in the three-dimensional structure of the heat conducting material is filled with a buffer.

A solid-filled encapsulated LED bulb with a base, at least one LED light source and at least one power supply element includes a transparent solid-filled heat-dissipating light guide member attached and covered onto the LED light source and the power supply element. A side of the heat-dissipating light guide member is packaged with the base to form the LED bulb. The heat of the LED light source is conducted and dissipated to the outside through the heat-dissipating light guide member. A light of the LED light source is outputted with an intensity I_A through the heat-dissipating light guide member. The intensity I_A of the light and the intensity IB of the LED light source satisfy the condition of (I_A/I_B)>70%. The use of a conventional dissipating structure is skipped to reduce the production cost and expedite the assembling and packaging processes while maintaining excellent heat dissipation and light output effects.