Semiconductor package with heat dissipating structure

Abstract

A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat portion for supporting the flat portion above a chip mounted on a substrate. The support portions are mounted at predetermined area on the substrate without interfering with arrangement of the chip and bonding wires that electrically connect the chip to the substrate. The support portions are arranged to form a space embraced by adjacent supports and the flat portion, so as to allow the bonding wires to pass through the space to reach area on the substrate outside coverage of the heat dissipating structure; besides, passive components or other electronic components can be mounted on the substrate at area within or outside the coverage of the heat dissipating structure, thereby improving flexibility in component arrangement in the semiconductor package.

Description

FIELD OF TIE INVENTIONThe present invention relates to semiconductor packages, and more particularly, to a semiconductor package with a heat dissipating structure.BACKGROUND OF TIE INVENTIONBall grid array (BGA) semiconductor packages are mainstream package products in the light of providing a sufficient amount of I / O (input / output) connections for use with semiconductor chips that incorporate high density of electronic elements and electronic circuits. As such a highly-integrated chip operates to consequently produce relatively more heat, it is thereby important to promptly remove the heat from the chip; otherwise, heat accumulation in the chip would undesirably damage electrical performances and reliability of package products. Moreover, for protecting internal components of the semiconductor package against external contamination, it usually forms an encapsulant that encapsulates the chip and other conductive elements such as bonding wires. The encapsulant is made of a resin mate...

AI Technical Summary

Benefits of technology

The present invention provides a semiconductor package with a heat dissipating structure that improves flexibility in component arrangement and heat dissipating efficiency. The heat dissipating structure is mounted on the substrate without interfering with the arrangement of the chip and bonding wires. The flat portion of the heat dissipating structure is elevated above the chip by the support portions and forms a predetermined height difference with respect to the substrate, allowing the bonding wires to pass through the space and reach the outside-coverage bond fingers. The heat dissipating structure can accommodate more flexibly-sized chips and components, and the support portions can reduce surface area of the substrate occupied by the heat dissipating structure, increasing the layout area for bonding wires and components. The flat portion of the heat dissipating structure has a recess and a protrusion to improve reliability and heat dissipating efficiency, respectively.

Problems solved by technology

As such a highly-integrated chip operates to consequently produce relatively more heat, it is thereby important to promptly remove the heat from the chip; otherwise, heat accumulation in the chip would undesirably damage electrical performances and reliability of package products.

The encapsulant is made of a resin material with poor thermal conductivity (coefficient of thermal conductivity around 0.8w / m°K); therefore, the chip-generated heat would not be efficiently dissipated to the atmosphere through the encapsulant; this would thereby adversely affect performances and lifetime of the chip by virtue of heat accumulation.

However, this heat dissipating structure is embedded in the encapsulant, such that the chip-generated heat still needs to pass through the encapsulant for dissipation.

Therefore, this structural arrangement cannot achieve satisfactory improvement in heat dissipating efficiency for the semiconductor package.

However, the above semiconductor package 3 has significant drawbacks.

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