Method of manufacturing a printed circuit board having embedded electronic components

a technology of electronic components and printed circuit boards, which is applied in the direction of printed circuit manufacturing, printed circuit non-printed electric components association, printed circuit aspects, etc., can solve the fundamental limit affecting yield, and raising the cost of manufacture. achieve the effect of increasing the number of embedded electronic components, improving heat release, and maintaining strength

Inactive Publication Date: 2010-06-24
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This design enhances mechanical strength, heat release efficiency, and allows for higher component density while minimizing bending in thermal-stress environments, reducing manufacturing costs and complexity.

Problems solved by technology

However, in a conventional printed circuit board having embedded electronic components, there is a high probability that problems in heat release due to embedding electronic components such as high-density IC's, or problems such as delamination, etc., will affect the yield, and there are difficulties in the overall process that raise the costs of manufacture.
Also, the process of embedding electronic components has hitherto involved a structure in which the electronic components are embedded in only one side of the core substrate, or in only one side of the build-up layer, which is inevitably vulnerable to bending in a thermal-stress environment.
Thus, there has been a fundamental limit to increasing the number of electronic components embedded.
However, it is limited in that the strength and heat-releasing property of the substrate itself are unchanged, and that it involves an asymmetric structure.
However, this considers only the matter of higher-density stacking, and is limited in that it does not consider the heat-releasing property of the substrate, and that it does not complement bending strength by forming a symmetrical structure.

Method used

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  • Method of manufacturing a printed circuit board having embedded electronic components
  • Method of manufacturing a printed circuit board having embedded electronic components
  • Method of manufacturing a printed circuit board having embedded electronic components

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Embodiment Construction

[0037]Certain embodiments of the present invention will be described below in more detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, those components are rendered the same reference number that are the same or are in correspondence regardless of the figure number, and redundant explanations are omitted.

[0038]FIG. 2 is a cross-sectional view of a printed circuit board having embedded electronic components based on a first disclosed embodiment of the present invention. In FIG. 2 are illustrated a core substrate 1, a core sheet 10, core holes 12, a first electronic component 20, a second electronic component 30, chip adhesive 22, 32, a first insulation layer 40, IVH's 42, a second insulation layer 50, circuit patterns 60, BVH's 62, and outer layer circuits 70.

[0039]A feature of the present invention is the structure of the core substrate 1, in which several electronic components are embedded while maintaining symmetry wi...

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Abstract

A method of manufacturing a printed circuit board having embedded electronic components. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a U.S. divisional application filed under 35 USC 1.53(b) claiming priority benefit of U.S. Ser. No. 11 / 637,664 filed in the United States on Dec. 13, 2006, which claims earlier priority benefit to Korean Patent Application No. 10-2005-0122289 filed with the Korean Intellectual Property Office on Dec. 13, 2005, the disclosures of which are incorporated herein by reference.BACKGROUND[0002]1. Field[0003]The present invention relates to a method of manufacturing a printed circuit board, more particularly, to a printed circuit board having embedded electronic components.[0004]2. Description of the Related Art[0005]As a part of next-generation multi-functional miniature package technology, attention is being focused on the development of a printed circuit board having embedded electronic components. Along with the advantages of multi-functionality and miniaturization, a printed circuit board having embedded electronic compon...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H05K3/30
CPCH01L23/5389Y10T29/4913H01L24/24H01L24/32H01L24/83H01L25/0657H01L2224/04105H01L2224/20H01L2224/24227H01L2224/73267H01L2224/8385H01L2224/92H01L2224/92244H01L2225/06524H01L2225/06589H01L2924/01002H01L2924/01005H01L2924/01013H01L2924/01015H01L2924/01029H01L2924/01033H01L2924/01038H01L2924/01078H01L2924/07802H01L2924/14H01L2924/15153H01L2924/1517H01L2924/15311H01L2924/19041H05K1/056H05K1/185H05K3/4608H05K2201/10515H01L24/19H01L2224/32245H01L2924/0665H01L2924/014H01L2924/01006H01L2224/2919H01L2224/83H01L2224/82H01L2924/00H01L2924/15747H01L2924/181H01L2924/351H01L2924/3511H05K1/18
InventorLEE, DOO-HWANMIN, BYOUNG-YOULKANG, MYUNG-SAMKIM, MOON-ILKIM, HYUNG-TAE
OwnerSAMSUNG ELECTRO MECHANICS CO LTD