Power module and circuit board assembly thereof

Abstract

A power module includes a first bobbin, a primary winding coil, a circuit board assembly and a first magnetic core assembly. The primary winding coil is wound around the first bobbin. The circuit board assembly includes a printed circuit board, a second winding structure, at least one current-sensing element, a rectifier circuit and an electrical connector. The second winding structure has an output terminal. The current-sensing element includes a first conductor. The first conductor is a conductive sheet. A first end of the first conductor is in contact with the output terminal of the second winding structure. A second end of the first conductor is connected to the rectifier circuit. The primary winding coil is aligned with the second winding structure of the circuit board assembly and arranged within the first magnetic core assembly. The primary winding coil and the electrical connector are electrically connected with a system board.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a power module and a circuit board assembly thereof, and more particularly to a power module and a circuit board assembly thereof in order to reduce power loss.BACKGROUND OF THE INVENTION[0002]With increasing development of electronic industries, electrical devices are developed toward high integration level and high power density. As known, the high power-density design usually results in high frequency characteristics. Especially, the high frequency characteristics of magnetic elements are more critical.[0003]FIG. 1 is a schematic perspective view illustrating the layout structure of a conventional power supply unit. As shown in FIG. 1, the conventional power supply unit 1 comprises a transformer 11, a rectifier 12 and a current transformer (CT) 13. The transformer 11, the rectifier 12 and the current transformer 13 are mounted on a system board 10. The primary winding coil of the transformer 11 receives an input voltage...

AI Technical Summary

Benefits of technology

[0006]An object of the present invention provides a power module and a circuit board assembly thereof in order to reduce the current path and the leakage inductance and increase the reliability and efficiency.

Problems solved by technology

As known, the high power-density design usually results in high frequency characteristics.

Under this circumstance, high power loss occurs at the welded sections and the current path.

Furthermore, since the current transformer 13 of the conventional power supply unit 1 usually generates increased leakage inductance, additional power loss occurs.

Under this circumstance, the reliability and the efficiency of the conventional power supply unit 1 are deteriorated.

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