Loop heat pipe structure

Inactive Publication Date: 2018-07-26
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is an improved loop heat pipe structure that overcomes the issue of dry-burning wick structure in conventional evaporators. The invention has a close proximity between the inlet of the evaporation chamber and the wick structure, which allows the condensed working fluid to flow back to the wick structure efficiently, thus avoiding the problem of dry-burning wick structure. Overall, the invention ensures efficient cooling of the system.

Problems solved by technology

While fans can indeed upgrade the heat dissipation performance of the electronic apparatus, they are not suitable for use in the electronic apparatus that have a very limited internal space.
The flat-type evaporator with overlapped compensation chamber and vapor core has a large height or thickness, and is therefore not suitable for a compact electronic apparatus that has very limited internal space.
As to the flat-type evaporator with horizontally positioned compensation chamber and vapor core, since there is some distance between the working fluid in the compensation chamber and the vaporizing surface of the vapor core, there are times the working fluid could not be timely supplied to the vapor core to result in the problem of dry burning of the vapor core.

Method used

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  • Loop heat pipe structure
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Embodiment Construction

[0019]The present invention will now be described with some preferred embodiments thereof and by referring to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.

[0020]Please refer to FIGS. 1 and 2, which are partially exploded perspective view and assembled sectional view, respectively, of a loop heat pipe structure 1 according to a first embodiment of the present invention. As shown, the loop heat pipe structure 1 in the first embodiment includes an evaporation chamber 11, a pipe 12 and a condensing unit 13.

[0021]The evaporation chamber 11 is a flat-type evaporation chamber having an outlet 111 and an inlet 112 and internally defines a receiving space 113. In the receiving space 113, there are a wick structure 114, a compensation chamber 115 and at least one vapor passage 1141. The vapor passage 1141 has an end communicable with the outlet 111. According to the present ...

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PUM

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Abstract

A loop heat pipe structure includes an evaporation chamber, a pipe and a condensing unit. The evaporation chamber has an outlet and an inlet and internally defines a receiving space. A wick structure, a compensation chamber and at least one vapor passage are provided in the receiving space, and the vapor passage has an end communicable with the outlet. The pipe has a first and a second end connected to the inlet and the outlet of the evaporation chamber, respectively, and the first end is located closely adjacent to the wick structure. The condensing unit is externally mounted on the pipe between the first and the second end. With the first end of the pipe being located closely adjacent to the wick structure, the working fluid can flow back to the wick structure more efficiently.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a loop heat pipe structure, and more particularly, to a loop heat pipe structure that enables upgraded vapor-liquid circulation efficiency in the loop heat pipe.BACKGROUND OF THE INVENTION[0002]The currently available electronic apparatus all have enhanced performance. As a result, electronic elements in the electronic apparatus for signal processing and computing also produce more heat than previous similar electronic elements. The most commonly used heat dissipation elements include heat pipe, heat sink, vapor chamber and so on. These heat dissipation elements are in direct contact with the heat-producing electronic elements to enable further enhanced heat dissipation performance of the electronic elements and prevent the same from burning out due to overheat.[0003]Further, fans can be mounted in the electronic apparatus to enable forced heat dissipation to remove heat from the heat dissipation elements. While fans can i...

Claims

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Application Information

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IPC IPC(8): F28D15/04F28D15/02
CPCF28D15/0233F28D15/04F28D15/043H01L23/427H05K7/20336
InventorTSAI, BOR-BIN
OwnerASIA VITAL COMPONENTS SHENZHEN CO LTD