Printing device and printing method for applying a viscous or pasty material

Inactive Publication Date: 2019-10-17
ROBERT BOSCH GMBH
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent aims to improve the ability to print small and fine structures from viscous or pasty materials using stencil printing on a carrier substrate. The objective is to increase the area and opening ratios that can be stably printed during stencil printing. Additionally, the patent provides means to create circuit substrates with material deposits by stencil printing, which can facilitate electrical contacting of components to a conductor structure for high-level miniaturization.

Problems solved by technology

The aspect ratio and the area ratio restrict the options for printing very small structures of solder paste or adhesive deposits.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printing device and printing method for applying a viscous or pasty material
  • Printing device and printing method for applying a viscous or pasty material
  • Printing device and printing method for applying a viscous or pasty material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050]In the figures, functionally identical components are each labeled with the same reference numeral.

[0051]FIG. 1a) shows an example of an embodiment of a printing device 100 for applying a viscous or pasty material at a time prior to the execution of a printing process. The printing device 100 comprises at least one support 10 for holding a carrier substrate 20 to be imprinted, in particular a circuit substrate. The carrier substrate 20 is, for example, a printed circuit board, a DBC, an LTCC, an IMC, a wafer or a solar cell. The carrier substrate 20 rests with its underside on the support 10. The carrier substrate 20 is preferably aligned by means of an alignment and / or fixing unit 12 within the printing device 100 with a defined orientation and / or fixed onto the bearing 10 in a stationary manner. On a top side of the carrier substrate 20, at least one bonding pad 25 is formed for electrically contacting to an electrical and / or electronic component. Using a stencil printing pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Lengthaaaaaaaaaa
Lengthaaaaaaaaaa
Fractionaaaaaaaaaa
Login to View More

Abstract

The invention relates to a printing device for applying a viscous or pasty material onto a support substrate and molding a defined material geometry by means of a template. The template which is provided for application and molding purposes has at least one continuous opening, and the opening side facing the support substrate functions as an application opening surface. Furthermore, the opening, in particular the inner wall thereof, forms an outer border for the material geometry outer surface to be molded. As a whole, the template is designed such that an adhesive force of the viscous or pasty material acting on the inner wall of the opening is overcome by means of a relative movement, in particular a movement relative to the support substrate. The template is advantageously formed as a stack composite of at least two sub-templates adjoining each other in a connection region. Each of the sub-templates has at least one sub-opening, by means of which the inner wall of the opening is divided into proportional molding surfaces of the sub-template. Furthermore, sub-opening connection surfaces which correspond to one another are formed in the connection region, and each of the sub-templates can be reversibly separated in the connection region.

Description

BACKGROUND OF THE INVENTION[0001]The invention relates to a printing device and a printing method for applying a viscous or pasty material, and to a circuit substrate with a printed material deposit.[0002]Modern electronic circuits are increasingly subject to the demands of a very compact construction. More and more electrical and / or electronic components must be interconnected in circuitry in ever tighter spaces, in order to achieve a high degree of miniaturization. As a suitable technology, surface mounting technology (SMT) has established itself over through-hole technology (THT). In this case, so-called SMD components are used, which have solderable bonding surfaces, which are then soldered directly onto a printed circuit board, for example. In order to enable a soldering process, solder paste deposits with a defined paste geometry are applied to bonding pads. Subsequently, the SMD components are mounted into the applied and unfused solder paste deposits via their bonding surfac...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/12H05K1/02H05K3/34B23K1/00
CPCH05K2203/0139B23K1/0008H05K2203/0121H05K1/0296B23K2101/42H05K3/1225H05K3/3484H05K2201/09845H05K3/3485
InventorGERA, GUENTER
OwnerROBERT BOSCH GMBH