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5results about How to "Improve bending deformation ability" patented technology

Valve clamping device with adjustable bearing force and valve clamping system

ActiveCN119235511AImprove axial deformation abilityImprove bending deformation abilityAnnuloplasty ringsMedicineMechanical engineering
The invention discloses a valve clamping device with adjustable bearing force and a valve clamping system. The valve clamping device comprises a supporting part and a clamping part, the hollow adjusting part is made of a shape memory material, one end of the adjusting part is arranged on the outer side of the supporting part in a sleeving mode and connected with the supporting part, and the other end of the adjusting part can move along the supporting part; the clamping part is arranged on the outer side of the adjusting part in a surrounding manner; the driving part is connected with the clamping part so as to drive the clamping part to be unfolded or folded around the adjusting part; when the clamping part is closed relative to the adjusting part, the near end of the adjusting part does not exceed the near end of the clamping part. Therefore, by means of the valve clamping device, the elastic fitting performance of the valve leaflet and the adjusting part can be improved, and then the adaptability of valve leaflet physiological structures of different patients is improved.
Owner:HANGZHOU VALGEN MEDTECH CO LTD

A stretchable flexible continuum and a continuum surgical robot

This invention relates to a stretchable flexible continuum and a continuum surgical robot. The flexible continuum has a cylindrical structure with multiple V-shaped grooves evenly spaced along both generatrix A and generatrix B in the circumferential direction. The V-shaped grooves on generatrix A and generatrix B are staggered along the central axis of the continuum. The depth of each V-shaped groove is greater than half the diameter of the continuum. Two arc-shaped notches are respectively provided on the two groove beams corresponding to the openings of the V-shaped grooves. The two groove beams are connected at the bottom of the V-shaped grooves by an arc-shaped connecting part. Except for the V-shaped grooves connected to the joint head and tail of the continuum, the two groove beams in any V-shaped groove have the same thickness. Through a specific groove design, the flexible continuum of this invention can achieve a large range of flexible bending deformation while also possessing high stretching performance.
Owner:TIANJIN UNIV

A composite reinforced flexible polyethylene composite pipe

This utility model discloses a composite reinforced flexible polyethylene composite pipe, relating to the field of composite pipes. It includes an outer polyethylene pipe and an inner polyethylene pipe, with the inner pipe located inside the outer polyethylene pipe. Multiple skeleton structures are fixedly installed between the outer and inner polyethylene pipes, and connecting rings are provided between each skeleton structure. This utility model can form a radially uniformly distributed rigid support, effectively suppressing radial deformation of the pipe. The steel frame plates are movably connected by flexible connecting frames, allowing the steel frame plates to deform collaboratively when the pipe bends. While ensuring the strength of the rigid support, it also improves the bending deformation capacity of the composite pipe. It allows the skeleton to slip slightly axially when the pipe is under pressure, dispersing local stress and avoiding brittle fracture. While increasing the support rigidity of the steel frame plates, it also allows the composite pipe to undergo local torsion, enabling the polyethylene composite pipe to form a dynamic balance mechanism between controllable deformation and rigid support.
Owner:ANHUI HONGXI BUILDING MATERIALS CO LTD

A flexible chip packaging structure and method

A flexible chip packaging structure includes a flexible circuit board, a flexible support film with a microstructure, and a flexible chip, wherein the flexible support film is arranged between the flexible circuit board and the flexible chip, and the flexible circuit board and the flexible chip are electrically interconnected. The present invention also discloses a flexible chip packaging method, including: providing a flexible circuit board and a flexible chip, providing a flexible support film with a microstructure, and bonding and fixing the flexible circuit board and the flexible chip; providing a gold wire bonding line, and electrically interconnecting the flexible chip and the flexible circuit board. The present invention can realize the flexibility of the chip packaging structure and increase its bending and deformation ability.
Owner:ZHEJIANG HEQING FLEXIBLE ELECTRONIC TECH CO LTD

Bent snake bone and probe

The utility model discloses a bent snake bone and a probe. The bent snake bone comprises a plurality of snake bone joints which are sequentially arranged at intervals in the length extending direction of the bent snake bone, and snake bone connecting sections which are integrally connected between every two adjacent snake bone joints. First notch grooves for providing bending spaces for the snake bone joints are respectively formed in two opposite sides of the snake bone connecting section of two adjacent sections of snake bone joints; each snake bone joint is provided with a first through hole formed in the length extending direction of the bent snake bone, and the multiple first through holes in the multiple snake bone joints extend in the length direction of the bent snake bone to form a first channel. And the first adjusting rope penetrates through the first channel and is used for driving the bent snake bone to bend. The multiple snake bone joints are connected into the integrated structure through the snake bone connecting sections, bending of the bent snake bone can be achieved through the snake bone connecting sections between the snake bone joints, and the problem that the connecting positions of the snake bone joints are prone to abrasion due to rotation during bending is solved. Moreover, the structure is simple, and the assembly operation is simpler.
Owner:EDAN INSTR