53results about How to "Increase unit area" patented technology

The invention relates to a semiconductor device and a fabrication method thereof. A semiconductor device according to an aspect of the invention comprising: a semiconductor layer on a substrate; an isolation layer on the semiconductor layer; a source and a drain which are in contact with the semiconductor layer, each of the source and the drain comprises multiple fingers, and the multiple fingers of the source intersect the multiple fingers of the drain; and a gate on the isolation layer, the gate is located between the source and the drain and comprises a closed ring structure which encircles the multiple fingers of the source and the drain.

The invention discloses a control method of a combined type air-conditioning system with a natural cooling function. The control method of the combined type air-conditioning system with the natural cooling function is characterized in that the system comprises a compressor module, an air-cooling heat exchange module, a multifunctional liquid storage device, a liquid pump, an air treatment module and control valves, wherein the air-cooling heat exchange module is composed of a heat exchanger assembly and a cooling fan; and the control method comprises the step that the three different work modes including a compression refrigeration work mode, a compression refrigeration and natural cooling coordinated operation combined refrigeration work mode and the natural cooling work mode are achieved by operating the control valves to change the flowing path of refrigeration media. According to the control method of the combined type air-conditioning system with the natural cooling function, fuzzy control is used for adjusting the refrigeration capacity, natural cooling is used for replacing compression refrigeration in low-temperature or transition seasons, natural cold resources are efficiently utilized, the control method is particularly suitable for control over the work environments of data centers, high-performance computers, communication base stations and power electronic equipment, and the energy consumption and operating cost of the air-conditioning system are greatly reduced.

A heat pipe heat dissipation structure includes a main body. The main body has an evaporation section, a condensation section, a chamber filled with a working fluid and at least one first capillary structure. The first capillary structure is disposed on an inner wall face of the chamber. The first capillary structure has at least one swelling capillary section. The swelling capillary section swells from a part of the first capillary structure in the evaporation section.