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Plate of earth conductor, and moveable type afflux set of earthwires of using the plate

A technology of confluence device and grounding wire, applied in connection, conductive connection, clamping/spring connection, etc., can solve the problem of grounding wire and equipment pipeline contact, etc., to change the configuration height, avoid grounding wire and equipment pipeline effect of contact

Inactive Publication Date: 2008-06-11
POWERCHIP SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Another object of the present invention is to provide a movable grounding wire confluence device to effectively solve the problem of contact between the grounding wire and the equipment pipeline due to space factors

Method used

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  • Plate of earth conductor, and moveable type afflux set of earthwires of using the plate
  • Plate of earth conductor, and moveable type afflux set of earthwires of using the plate
  • Plate of earth conductor, and moveable type afflux set of earthwires of using the plate

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Embodiment Construction

[0045] Please refer to FIG. 3 , which is a space layout diagram of a movable ground wire converging device applied under a machine placement plate in a preferred embodiment of the present invention. It can be seen from FIG. 3 that the support column 22 is used to support the machine placement plate 22a, and the two ends of the ground wire 24 are respectively coupled to the ground wire plate 200 arranged on the periphery of the support column 22. The ground wire plate 200 arranged on the periphery of the supporting column 22 is adjusted to its disposition height, so as to prevent the ground wire 24 from contacting the equipment pipeline 30 .

[0046] Please refer to Fig. 4, Fig. 5 and Fig. 6, wherein Fig. 4 is a perspective view of a movable grounding wire converging device in a preferred embodiment of the present invention, and Fig. 5 is a movable grounding wire converging device and grounding wire in a preferred embodiment of the present invention and the connection diagram o...

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Abstract

The earthwire board includes conductive terminal seat, insulative fixed seat, and fixing clamp. Being in halfring shape, the conductive terminal seat includes contact connectors for ground earthwire, and contact connectors for equipment earthwire. The insulative fixed seat includes bearing seat, and fixing base. Being in notch shape, front face of the bearing seat is for the conductive terminal seat to be installed. Back face of the bearing seat is coupled to the fixing base in order to be sheathed to corresponding support column. Surrounding outer edge of the fixing base, the fixing clamp fixes the fixing base to corresponding support column. The earthwire board couples equipment earthwire to ground earthwire electrically. Being arranged on outer edge of the support column, the earthwire board can move vertically to change arranged height so as to be able to prevent earthwire from contacting to pipeline of equipment.

Description

technical field [0001] The invention relates to a grounding wire plate, in particular to a movable grounding wire converging device using the grounding wire plate. Background technique [0002] In order to maintain the safety of electrical equipment, electrical equipment has a grounding wire. In order to provide convenience for users, there are also grounding wire plates in the buildings as centralized management of each grounding wire. [0003] Please refer to FIG. 1 and FIG. 2 at the same time. FIG. 1 is a space layout diagram of the existing grounding wire plate arranged under the machine table placement plate, and FIG. 2 is a schematic diagram of the connection between the existing grounding wire board and the grounding wire. The existing grounding wire plate 10 is composed of a bridge portion 11 connecting two bases 12 fixed on the ground. The bridge portion 11 is provided with a plurality of holes (not shown in the figure) for locking with screws 13 , and each screw ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R9/00H01R4/28
Inventor 王清松陈文宗
Owner POWERCHIP SEMICON CORP