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Electric connector with separate earthed wafer

An electrical connector, ground plane technology, applied in the direction of connection, connecting contact material, two-part connecting device, etc., can solve problems such as interference and reduce the performance of electrical connectors

Inactive Publication Date: 2008-11-12
TE CONNECTIVITY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This new current flows from one differential pair to the other via the common ground plane, causing interference and degrading performance within the electrical connector

Method used

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  • Electric connector with separate earthed wafer
  • Electric connector with separate earthed wafer
  • Electric connector with separate earthed wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] FIG. 1 is a front view of the first side 10 of the wafer 11 . Wafer 11 includes a main body 12 defined by a mounting edge 13, which is received and retained within the electrical connector housing organizer, and a top edge 16 and a rear edge 18, which is intended for contact with another wafer. The meshing edges mesh. The chip 11 is accommodated and held within a connector housing, such as housing 1112 shown in FIG. 9 . A plurality of ground terminals 20 and signal terminals 22 are positioned proximate to each other in an alternating fashion along the mounting edge 13 . That is, each signal terminal 22 is located between two ground terminals 20 . Vias 24 are formed in each of ground terminal 20 and signal terminal 22 and allow electrical signals to be transmitted from first side 10 of wafer 11 to second side 42 of wafer 11 (shown in FIG. 2 ).

[0021] A plurality of ground tabs 26 and signal tabs 28 are located adjacent to and in an alternating pattern along the mati...

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PUM

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Abstract

An electrical wafer configured to be housed within an electrical connector comprising a main body, and a plurality of signal routes, gap routes and ground planes. The plurality of signal routes, gap routes and ground planes may be positioned on each of the first and second sides of the main body. Alternatively, all of the signal routes may be on one side, while all of the ground planes may be on the other side. Each ground plane on one side of the wafer is positioned between two gap routes, or a gap route and a signal route.

Description

technical field [0001] This invention relates to wafers or circuit boards for use in electrical connectors. Background technique [0002] An electrical connector that is a board-to-board type connector may include a plurality of circuit boards or dies having edges that engage the edges of corresponding contacts in adjacent connectors. [0003] Figure 7 is a partial cross-sectional view of a conventional transistor 100 . Transducer 100 includes a body 112 constructed of a dielectric material, such as molded plastic. Signal tracks 114 are located on one side 102 of the transistor 114 and may be separated from each other by gaps. The second side 104 of the die includes at least one ground plane 116 . as Figure 7 As shown, the ground plane 116 is shared by the two signal tracks 114 . Thus, power can be transferred from the first signal track to the ground plane 116 and into the second signal track (as indicated by the arrow). [0004] An example of an electrical connector...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/00H01R13/66H01R12/22H01R4/66H01R12/71
CPCH01R12/725H01R13/6585H01R23/005H01R23/7078H01R4/66H01R13/6471
Inventor 布伦特·R·罗瑟梅尔查德·W·摩根亚历山大·M·沙夫戴维·W·赫尔斯特
Owner TE CONNECTIVITY CORP