Unlock instant, AI-driven research and patent intelligence for your innovation.

IC module

A circuit and circuit connection technology, applied in the direction of circuits, electrical components, electrical solid devices, etc.

Inactive Publication Date: 2009-03-11
DAI NIPPON PRINTING CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is impossible for the key holder type ID module to be manufactured and issued in the same process as the conventional IC card

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • IC module
  • IC module
  • IC module

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0140] The present invention relates to SIMs and SIM jackets. First, the SIM used in the present invention, that is, the ID module will be introduced.

[0141] The SIM (ID module) used in the present invention is the above-mentioned SIM, UIM or USIM (hereinafter, "SIM" will be used as a general term for ID modules including UIM and USIM in the following description and claims), which is not used IC chips for contact and contactless applications, ie IC chips with dual interfaces, IC chips also provided with antenna coils for contactless communication are used in some embodiments.

[0142] A conventional contact SIM communicates with a PDA (Personal Digital Assistant) in contact communication through a terminal strip connected to a terminal of the PDA. The SIM of the present invention is different from the traditional contact SIM in terms of communication methods.

[0143] The SIM (ID Module) used in the present invention, which is also used as a prepaid card and a card for tr...

no. 2 example

[0203] The present invention relates to SIMs and SIM jackets. First, the SIM used in the present invention, that is, the ID module will be introduced.

[0204] The SIM (ID module) used in the present invention is the above-mentioned SIM, UIM or USIM (hereinafter, "SIM" will be used as a general term for ID modules including UIM and USIM in the following description and claims), which is not used IC chips for contact and non-contact applications, that is, IC chips with dual interfaces.

[0205] The term "SIM" will be used as a generic term for a small ID module whose size corresponds to a plug-in SIM as specified by GSM.1111 or 3GPP TS 11.11. The function of the SIM is not limited to the above-mentioned subscriber identification means for portable phones. Sometimes the term "UIM" may be used instead of "SIM".

[0206] A second embodiment of the present invention will be described below with reference to the drawings.

[0207] Figure 12 is a view of a SIM according to a seco...

no. 3 example

[0268] As described above, the present invention relates to an IC module provided with three types of interfaces (sometimes referred to as "the IC module of the present invention"), a triple SIM and a SIM holder, a triple IC card and an IC card holder. First, the IC module of the present invention will be described.

[0269] Figure 22 is an auxiliary view for explaining an IC chip included in an IC module according to a third embodiment of the present invention, Figure 23 It is an auxiliary view for explaining the relationship between the terminal (pad) of the IC chip and the contact terminal piece.

[0270] Figure 24 is the view of the IC module in Example 3-1, Figure 25 is the view of the IC module in Example 3-2, Figure 26 is a view of the IC module in Example 3-3, Figure 27 is a view of the IC module in Example 3-4, while Figure 28 is a view of the IC module in Example 3-5.

[0271] The IC module 204 of the present invention has a substrate 204a, an IC chip 2...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A SIM comprises a substrate, an IC chip mounted on the substrate and provided with a dual interface for contact and noncontact communication, and a contact-terminal plate mounted on the substrate and provided with a plurality of contact terminals. A SIM holder for holding the SIM is provided with an antenna coil, and the antenna terminals of the IC chip are connected to terminals C 4 and C 8 among the eight terminals C 1 to C 8 of the SIM. The terminals C 4 and C 8 are connected to the antenna coil of the SIM holder.

Description

technical field [0001] The present invention relates to SIM, SIM jacket, IC (integrated circuit) module, IC card and IC card jacket. More specifically, the present invention relates to a SIM (ID module) provided with a non-contact IC chip, a SIM holder capable of detachably fixing the SIM, an IC module, an IC card, and an IC card holder. Background technique [0002] In recent years, a key fob type ID module that can be carried with a door key has been used. This ID module is provided with a built-in non-contact IC chip and a built-in antenna, and is manufactured by injection molding or the like. [0003] For example, as mentioned in Nikkei Sangyo Shinbun, Frontpage, August 7, 2002, the gas fee purchased at a self-service gas station can be paid by the key cover and the note when the key cover is placed against the automatic billing system. Instant payments in a contactless manner through contactless communication between pumps. [0004] Payment is then made by credit car...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077
CPCG06K19/07733H01L2924/01079G06K19/07769G06K19/07743H01L2924/19107G06K19/07741H01L2924/14G06K7/006G06K19/07732H01L2924/01078H01L2224/48228H01L2924/01057H01L2924/19041G06K19/07749H01L2224/48091H01L2224/49171H01L2224/73265H01L2224/32225H01L2224/48227H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012G06K19/077
Inventor 西川诚一
Owner DAI NIPPON PRINTING CO LTD