Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Handler for testing of packed chip

A technology for testing packaging and handling machines, applied in the field of handling machines, can solve problems such as the complex structure of the pallet conveying device

Inactive Publication Date: 2007-11-28
MIRAE CORPORATION
View PDF0 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The rotation and linear movement of the holding rod and the transfer rod complicate the structure of the pallet transfer device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Handler for testing of packed chip
  • Handler for testing of packed chip
  • Handler for testing of packed chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Reference will now be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.

[0017] FIG. 1 is a cross-sectional view showing a tray transfer device according to an embodiment of the present invention.

[0018] As shown in FIGS. 1 to 3 , a chamber disposed in a handler for testing packaged chips according to the present invention includes two or more transfer rods 10 (three transfer bars 10 are taken in this embodiment for the purpose of illustration). pole). The delivery rod 10 is provided to extend from the inner front side of the chamber 1 to the inner rear side of the chamber 1 . The transfer rod 10 has threaded grooves 11 on its outer surface. One side of the tray T is inserted into the threaded groove of the transfer rod 10 .

[0019] The chamber according to the embodiment of the present invention has two transfer rods 10 supporting the lower side of the tray T and one transfer rod support...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a handler for testing semiconductor equipped with a tray transfer device that has a simple structure and can safely transfer a test tray. The handler for testing semiconductors comprises a tray to which a semiconductor device is attached, a transfer member, rotating to transfer the tray, while at least one portion of the edge of the tray is being stored, and a drive unit for rotating the transfer member. The above tray is moved in the longitudinal direction of the transfer member by a force applied by the rotation of the transfer member.

Description

technical field [0001] The present invention relates to a handler for testing packaged chips, and more particularly to a handler for testing packaged chips equipped with a tray transfer device capable of transferring containers containing Trays with packaged chips. Background technique [0002] At the end of the packaging process, the handler subjects the packaged chip to a series of environmental, electrical, and reliability tests. These tests vary in type and specification depending on the user and the purpose of the packaged device. These tests can be performed on all multiple packages or on selected samples. Conduct environmental testing, such as temperature cycling, to weed out leaking and defective packages. Packaged chips are loaded into the chamber and cycled between two temperature extremes. The number of cycles can reach hundreds of times. The high and low temperatures for this test vary with the use of the device. During cycling, any defects in sealing, die ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/677H01L21/66H01L21/00G01R31/26G01R31/28G01R1/02
CPCG01R31/2893H01L21/683
Inventor 秋升甬朴性文林勇进
Owner MIRAE CORPORATION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com