High speed differential signal transmission structure

一种高速差分、信号传输的技术，应用在可编程/可定制/可修改电路、仪器、电数字数据处理等方向，能够解决无法共用、增加主板设计成本等问题，达到节省设计费用的效果

Inactive Publication Date: 2008-03-05
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Different motherboard product specifications will choose to install different connectors. For example, some manufacturers require only one PCI-Express x8 connector to be installed on the motherboard, while some manufacturers require two PCI-Express x4 connectors to be installed on the motherboard. Therefore, even if the control chip supports connectors of two specifications, only one kind of production can be selected during production, that is, a motherboard that supports one PCI-Express x8 connector, or a motherboard that supports two PCI-Express x4 connectors. cannot share
Therefore, according to the requirements of different manufacturers, it is necessary to redesign the motherboard wiring, which increases the cost of motherboard design.

Method used

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  • High speed differential signal transmission structure

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Embodiment Construction

[0008] Referring to FIG. 1 , a high-speed differential signal transmission architecture 20 includes a signal control chip 22 , a first connector pad 24 , a second connector pad 26 , a plurality of first transmission lines 28 and a plurality of second transmission lines 29 . The first connector pad 24 is connected to the signal control chip 22 through the first transmission line 28, and the second connector pad 26 is connected to the first connector pad through the second transmission line 29. 24, and a resistor R is connected in series with each second transmission line 29.

[0009] When a first connector is installed on the first connector pad 24, the second connector pad 26 is empty, and the resistor R on the second transmission line 29 is removed, so that the second transmission line 29 disconnect. The transmission line between the first connector pad 24 and the resistor R becomes a stub, the open circuit effect of this stub will generate signal reflection, in order to avo...

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Abstract

The invention comprises: a signal control chip, a first connector bonding pad, several first transmission lines, a second bonding pad and several second transmission lines. Said first connector is connected to said signal control chip via said first transmission line; said second connector bonding pad is connected to the first transmission line via the second transmission line; on each second transmission line there is a switch. By the invention, two different connectors can be selectively installed on a motherboard by controlling the switch.

Description

technical field [0001] The invention relates to a high-speed differential signal transmission architecture. Background technique [0002] On the mainboard of present general personal computer, except central processing unit, control chip set, also have some connectors that are used to install the interface card. With the development of the electronic industry, the functions of the control chip are further improved. The same control chip can support different connectors. For example, a PCI-Express control chip can support 1 PCI-Express x8 connector or 2 PCI-Express connectors at the same time. -Express x4 connector. Different motherboard product specifications will choose to install different connectors. For example, some manufacturers require only one PCI-Express x8 connector to be installed on the motherboard, while some manufacturers require two PCI-Express x4 connectors to be installed on the motherboard. Therefore, even though the control chip supports connectors of tw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F13/40
CPCG06F13/4068G06F2213/0024H05K2201/10363H05K1/0295H05K1/029
Inventor 许寿国李政宪
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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