Stacking electronic component and its clamping component

Abstract

The invention discloses a heap type electronic component and a holding component thereof. The electronic component is arranged on a circuit board and includes a plurality of energy-stored units, each has a first electrode and a second electrode; and the holding component, including a first holding structure and a second holding structure arranged corresponding with the first holding structure. The holding structures have a panel, with two corresponding lateral sides extending and arranged with at least a holding part respectively; at least a guide connection part, in connection with the panel and the circuit board; wherein, at least one holding part of the first and the second holding structures is used to hold and fix the plurality of energy-stored units so that the first and the second electrodes are connected with the panels of the first and the second holding structures respectively. Thereby, the first and the second electrodes of the plurality of energy-stored units are electrically connected with the circuit board via the panels of the first and the second holding structures and at least one guide connection component. The invention can effectively solve the problem of reduced fixation effect caused by welding material fusing in the manufacture process of the heap type electronic component.

Description

technical field [0001] The present invention relates to an electronic component and its clamping assembly, in particular to a stacked electronic component and its clamping assembly. Background technique [0002] With the advancement of technology, the operating efficiency of electronic devices has been continuously improved. In order to improve the operating efficiency and meet the trend of product miniaturization, the volume of electronic devices must be continuously reduced, and the internal structure must be arranged more closely. Therefore, stacking Type electronic components are born accordingly, taking capacitors as an example, in order to increase the capacitance and save the installation space of the capacitor on the circuit board, a so-called stacked capacitor is formed. [0003] Please refer to FIG. 1, which is a schematic structural diagram of a known stacked capacitor. As shown in the figure, a stacked capacitor 1 is arranged on a circuit board 2 and may be compo...

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Problems solved by technology

[0004]However, the known stack capacitor 1 is connected between the first electrode 101 and the second electrode 102 of the energy storage unit 10 and the first metal terminal 11 and the second metal terminal 12 During the welding process, if the alignment between the first electrode 101 and the first metal terminal 11 or the alignment between the second electrode 102 and the second metal terminal 12 is slightly deviated, it may be weakened due to the reduction of the solder 13 area. The strength of the solder 13 prevents the first metal terminal 11 and the second metal terminal 12 from being reliably connected and fixed to the energy storage unit 10

In addition, since the stack capacitor 1 must be fixed on the circuit board 2 with solder 14, the solder 13 between the first electrode 101 and the first metal terminal 11 of the energy storage unit 10 or the solder 13 between the second electrode 102 and the second metal terminal The solder 13 between 12 may also be melted due to high temperature during the surface adhesion process, so that the energy storage unit 10 is not electrically connected to the first metal terminal 11 or the second metal terminal 12

[0005]Secondly, the electronic components on the circuit board 2 will generate a large amount of heat energy during operation, causing the circuit board 2 to expand due to heat, and due to the thermal expansion coefficient of the stacked capacitor 1 and the circuit The thermal expansion coefficient of the board 2 is inconsistent, so when the circuit board 2 is heated and expanded, it is very easy to cause the energy storage unit 10 to break and damage the structure of the stacked capacitor 1, resulting in the failure of the stacked capacitor 1 to operate normally

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