167results about "Fixed capacitor details" patented technology

A method and apparatus for use in a digitally tuning a capacitor in an integrated circuit device is described. A Digitally Tuned Capacitor DTC is described which facilitates digitally controlling capacitance applied between a first and second terminal. In some embodiments, the first terminal comprises an FW+ terminal and the second terminal comprises an RF terminal. In accordance with some embodiments, the DTCs comprises a plurality of sub-circuits ordered in significance from least significant bit (LSB) to most significant bit (MSB) sub-circuits, wherein the plurality of significant bit sub-circuits are coupled together in parallel, and wherein each sub-circuit has a first node coupled to the first RF terminal, and a second node coupled to the second FW terminal. The DTCs further include an input means for receiving a digital control word, wherein the digital control word comprises bits that are similarly ordered in significance from an LSB to an MSB.

An embedded MIM capacitor in a logic circuit and method for forming the same are disclosed. The device includes a substrate, a bottom electrode, a dielectric film, and a top electrode. The substrate comprises an insulator region. The bottom electrode comprises a first conductor and overlies the insulator region. The dielectric film overlies the bottom electrode, remaining parts of the bottom plate exposed. The top electrode comprises a second conductor and overlies the dielectric film. The dielectric film lines sidewalls and bottom of the top electrode.

A wireless power transmission system comprising a transmitting inverted Tesla Coil or Magnifier connected to the ground by its high voltage terminal using a capacitive earth connection and transmitting power through the ground to a subsequent receiving Tesla Coil or Magnifier being well earthed through a capacitive earth connection or conventional earth with the distance between the two earth connections of the transmitter and receiver plus the length of the coils in the transmitter and receiver forming a tuned length and the system thus composed being operated at a frequency that is an harmonic or close to an harmonic of the tuned length thus established.

Methods of configuring a cooling subassembly for an electronics system are provided, that is, for establishing a coolant-carrying tube layout for interconnecting multiple liquid-cooled cold plates in series-fluid communication for cooling multiple heat-generating electronic components of an electronics system. The electronic components are to be plugged in fixed relation into a preconfigured motherboard, and the tube layout includes at least one rigid coolant-carrying tube. Simplified analysis is initially performed to evaluate stress on the rigid tube(s) and determine if loss of actuation load on the electronic components exceeds an acceptable threshold, and if so, at least one tube having high stress is identified and reconfigured. Thereafter, analysis is performed to determine whether, with available actuation load on the cooling subassembly, electrical connection loading between the electronic components and the supporting motherboard is above an acceptable minimum level. If so, the coolant-carrying tube layout is chosen as a final design.

An electronic component structure is proposed, wherein an interposer thin film capacitor structure is employed between an active electronic component and a multilayer circuit card. A method for making the interposer thin film capacitor is also proposed. In order to eliminate fatal electrical shorts in the overlying thin film regions that arise from pits, voids, or undulations on the substrate surface, a thick first metal layer, on the order of 0.5-10 mm thick, is deposited on the substrate upon which the remaining thin films, including a dielectric film and second metal layer, are then applied. The first metal layer is comprised of Pt or other electrode metal, or a combination of Pt, Cr, and Cu metals, and a diffusion barrier layer. Additional Ti layers may be employed for adhesion enhancement. The thickness of the first metal layers are approximately: 200 A for the Cr layer; 0.5-10 mm for the Cu layer; 1000 A-5000 A for the diffusion barrier; and 100 A-2500 A for a Pt layer.

A galvanically isolated signal conditioning system includes a signal conditioning circuit on an integrated circuit chip; a flying capacitor; and a galvanically isolating MEMS switching device on an integrated circuit chip for selectively switching the flying capacitor from across a pair of input terminals in one state to across the input terminals of the signal conditioning circuit in another state.

The present invention provides a capacitor for an inverter of a vehicle comprising a case; a plurality of capacitor unit modules; positive and negative bus plates that are disposed in the case to be connected to the capacitor unit modules; and a power module corresponding to the unit modules, wherein that the unit modules are insulated from each other through an insulating material, and wherein the bus plates each comprise a bus bar that overlaps with the other bus bar and is electrically connected to the power module.

Methods of configuring a cooling subassembly for an electronics system are provided, that is, for establishing a coolant-carrying tube layout for interconnecting multiple liquid-cooled cold plates in series-fluid communication for cooling multiple heat-generating electronic components of an electronics system. The electronic components are to be plugged in fixed relation into a preconfigured motherboard, and the tube layout includes at least one rigid coolant-carrying tube. Simplified analysis is initially performed to evaluate stress on the rigid tube(s) and determine if loss of actuation load on the electronic components exceeds an acceptable threshold, and if so, at least one tube having high stress is identified and reconfigured. Thereafter, analysis is performed to determine whether, with available actuation load on the cooling subassembly, electrical connection loading between the electronic components and the supporting motherboard is above an acceptable minimum level. If so, the coolant-carrying tube layout is chosen as a final design.

A device includes an embedded MIM capacitor and a transistor formed in parallel with reduced processing steps and improved device performance in different regions of a substrate. The embedded MIM capacitor has a bottom electrode, an insulator layer, a dielectric film, and a top electrode. The substrate has an insulator region. The bottom electrode, having a first conductor, overlies the insulator region. The insulator layer overlies the substrate and the bottom electrode. The insulator layer has an opening connecting parts of the bottom electrode. The dielectric film lines the opening, and is disposed directly on the bottom electrode and sidewalls of the opening. The top electrode, having a second conductor, overlies the dielectric film in the opening. The dielectric film lines sidewalls and bottom of the top electrode.

In an energy storage device (1) with evaporation cooling wherein the boiling temperature of a liquid which is disposed in heat exchange relationship with electric capacitors (2, 3, 4) for limiting the operating temperature of the electric capacitors, a thermal vapor condensing arrangement is provided for condensing the vapors formed from the liquid during cooling of the electric capacitors and returning the condensate back to the liquid surrounding the electric capacitors.

A circuit for driving a transducer in a mid-air haptic system includes a voltage source, a voltage sink, a current source, a trickle capacitor, a storage capacitor, a haptic system transducer, a first switch, a second switch, and a third switch. Using these components, a portion of the charge required for switching a transducer is sourced from the decoupling capacitance. When the switching completes, additional charge is transferred immediately from the power supply back into the decoupling capacitance. This acts to lower the peak current by fully utilizing 100% of a switching waveform for transfer of charge from the power supply to capacitors local to the transducer.

Disclosed is a method for producing a polymeric ferroelectric material. The method can include (a) obtaining a polymeric ferroelectric precursor material, and (b) subjecting the polymeric ferroelectric precursor material to pulsed electromagnetic radiation sufficient to form a polymeric ferroelectric material having ferroelectric hysteresis properties, wherein the polymeric ferroelectric precursor material, prior to step (b), has not previously been subjected to a thermal treatment for more than 55 minutes.

The invention relates to humidity-sensitive polyimide, preparation and applications thereof. The humidity-sensitive polyimide comprises maleimide-based polyimide, bismaleimide and ammonia end-group imide oligomer with the weight ratio being 1:(0.1-0.2):(0.4-0.8), and an organic solvent. The preparation method comprises the following steps of preparing the maleimide-based polyimide and the ammonia end-group imide oligomer respectively, and carrying out copolymerization with the bismaleimide to obtain the humidity-sensitive polyimide. The molecular weight of the adopted material resin is easy to control, the molecular structure of the adopted material resin is also easy to adjust, thereby being beneficial to preparing the function material of the humidity-sensitive polyimide with ideal performance; and the invention has the advantages of simple process, low cost, environmentally-friendliness, capability of finishing the preparation process in universal equipment and suitability for industrial production.

The electronic monitoring circuit for monitoring one of a group of series-connected capacitor units in an intermediate circuit in order to detect short-circuiting of one of the capacitor units includes a device for deriving a reference voltage (14) from an intermediate-circuit voltage (L(+), L(−)) applied across the series-connected capacitor units (1, 2), a device for generating a control signal consisting of a voltage difference between the reference voltage (14) and a junction voltage at a junction (13) between two capacitor unit (1, 2) and a device for generating an error signal when said voltage difference falls below or exceeds an activation threshold voltage thus indicating that one of the capacitor units (1,2) has been short-circuited. The activation threshold voltage corresponds to a breakdown voltage of a zener diode provided in the monitoring circuit.

Tube amplifier assembly including a power tube that is configured to be coupled to a grounding deck and positioned within an opening of the grounding deck. The tube amplifier assembly also includes a tube adapter that is configured to be coupled to the grounding deck. The tube adapter has a capacitive plate that extends parallel to the grounding deck and an adapter wall that is coupled to the capacitive plate. The tube adapter has an adapter opening that is aligned with the deck opening to form a tube passage. The tube adapter includes flexible conductive elements that are electrically coupled to the capacitive plate and surround the tube passage. The flexible conductive elements engage the power tube in the tube passage and electrically couple the power tube to the capacitive plate. The grounding deck and the capacitive plate form a capacitor assembly.

A galvanically isolated signal conditioning system includes a signal conditioning circuit on an integrated circuit chip; a flying capacitor; and a galvanically isolating MEMS switching device on an integrated circuit chip for selectively switching the flying capacitor from across a pair of input terminals in one state to across the input terminals of the signal conditioning circuit in another state.

Etch solutions for selectively etching doped oxide materials in the presence of silicon nitride, titanium nitride, and silicon materials, and methods utilizing the etch solutions, for example, in the construction of container capacitor constructions are provided. The etch solutions are formulated as a mixture of hydrofluoric acid and an organic acid having a dielectric constant less than water, optionally with an inorganic acid, and a pH of 1 or less.

A circuit for driving a transducer in a mid-air haptic system includes a voltage source, a voltage sink, a current source, a trickle capacitor, a storage capacitor, a haptic system transducer, a first switch, a second switch, and a third switch. Using these components, a portion of the charge required for switching a transducer is sourced from the decoupling capacitance. When the switching completes, additional charge is transferred immediately from the power supply back into the decoupling capacitance. This acts to lower the peak current by fully utilizing 100% of a switching waveform for transfer of charge from the power supply to capacitors local to the transducer.

The invention provides a low-noise high-voltage power capacitor unit, which comprises a mandril, a box shell and a wire connecting terminal, wherein the upper end and the lower end in the box shell are provided with sound-absorbing devices; the sound-absorbing devices are sound-absorbing cavities and / or vibration energy-dissipating devices; the sound-absorbing cavities are cavities of which the upper ends and the lower ends in the box shell are parallel to the placement direction of an element and the inner height divided by a partition plate is 1 to 100 mm, and the inner wall can adhere a sound-absorbing material with the thickness of 0.1 to 10 mm; the vibration energy-dissipating device is 5 to 8 layers of overlapping insulation frame plates and insulation vibrating plates, one vibrating plate is arranged between each two frame plates, and the frame plate is a porous plate with the thickness of 1 to 5 mm, and holes accounts for 50 to 90 percent of the total area; the frame plates are provided with rectangular frames with the same tops and bottoms as the mandril; and the vibrating plate is a rectangular plate with the same thickness of 0.1 to 0.8 mm as the top and the bottom of the mandril; and the vibration energy-dissipating device is fixed on the top and the bottom of the mandril, and the outside of the vibration energy-dissipating device is a splint of the mandril of a capacitor. The low-noise high-voltage power capacitor unit obviously reduces noise of the mandril of the capacitor, and prevents the spreading of the noise in running; and the sound-absorbing device is positioned in the box shell of the capacitor unit and does not need arranging additionally.

A detecting fixture for detecting a capacitor with leakage current among a capacitor group in parallel connection includes a reference voltage generator, an impedance converter, a comparator and a display unit. Wherein, the reference voltage generator is used for outputting a first voltage, the impedance converter is used for converting the impedance of the capacitor group in parallel connection into a second voltage and the comparator is respectively coupled with the outputs of the reference voltage generator and the impedance converter for comparing the first voltage with the second voltage. The display unit is coupled with the output of the comparator, wherein the second voltage is altered by heating a capacitor among the capacitor group in parallel connection and the comparator outputs a voltage difference in response to the altered second voltage, so that the display unit is able to indicate whether or not the corresponding capacitor has leakage current.

The invention discloses a dry-type composite-dielectric filter capacitor, which comprises a capacitor core, a pin, and an encapsulation layer coated outside the capacitor core, wherein the capacitor core consists of a polypropylene film plated with a metallic layer and a metallized polyester film which are superposed in turn and are coiled in a non-inductive mode, the metallic layer is a zinc-aluminum composite layer, the metallized film has a 'natural repair' characteristic, small loss and large capacitance, the encapsulation layer is an epoxy resin solidified layer, thus not only the insulation strength of the capacitor is ensured, but also the safe use of the capacitor under a severe condition is ensured.

Apparatus and program product for designing vertical parallel plate (VPP) capacitor structures in which the capacitor plates in different conductive layers of the capacitor stack have a different physical spacing. The methodology optimizes the physical spacing of the plates in each conductive layer to achieve a targeted electrostatic discharge protection level and, thereby, supply electrostatic discharge robustness.

An electrical element includes an optically-detectable pattern of embedded information. A plurality of thin-film layers is applied on the surface of the substrate wherein one or more of the thin-film layers is at least partially transparent. The plurality of thin-film layers overlaps in an encoding region to form an optical layer structure, wherein at least one of the thin-film layers in the optical layer structure contributes to an electrical function of the electrical element. At least one of the thin-film layers in the optical layer structure includes an information-encoding pattern which contributes to an optically-detectable interference image when illuminated by incident light, and wherein the optically-detectable interference image corresponds to at least a portion of the pattern of embedded information.

The invention discloses a high-voltage electric capacitor. The high-voltage electric capacitor is characterized in that the high-voltage electric capacitor comprises a base, a first section of insulator, a second section of insulator, a third section of insulator, a fourth section of insulator, a fifth section of insulator and a sixth section of insulator, the first section of insulator, the second section of insulator, the third section of insulator, the fourth section of insulator, the fifth section of insulator and the sixth section of insulator are arranged on the base with the diameters sequentially increasing from top to bottom, the base comprises three supporting insulators and supports, the supporting insulators are distributed to form an equilateral triangle, the supports are arranged at the upper ends of the supporting insulators, the diameter of each supporting insulator is 356mm, and the diameters of the six sections of insulators are 610mm, 610mm, 665mm, 705mm, 715mm and 715mm in sequence from top to bottom. The high-voltage electric capacitor is simple and reasonable in structure, the three supporting insulators are arranged on the base, the diameters of the six sections of insulators arranged on the base increase from top to bottom in a trapezoid mode, and therefore the gravity center of the capacitor is stable, damage such as external wind power and earthquakes can be better resisted, cost is saved, and the service life of the capacitor is prolonged.

The present invention relates to a composite electronic component having a dielectric body portion inside of which a conductive body is provided, and a magnetic body portion inside of which a conductive body is provided. In the present invention, a layer made of a metal material is arranged between the dielectric body portion and the magnetic body portion as an intermediate layer.

The invention relates to an all-solid-state power storage device which mainly comprises an electrode, a charge storage material and an insulating material. The charge storage material comprises a positive charge storage material and an electronic storage material which are separated by the insulating material, and a sandwich structure of an electrode / the positive charge storage material / the insulating material / the electronic storage material / an electrode is formed. The positive charge storage material contacts with a positive electrode, and the electronic storage material contacts with a negative electrode. The all-solid-state power storage device is high in energy density and power density, environment-friendly, and high in safety.

A connector insert comprising a plurality of layers of conductive elastomer, and a concomitant method of employing a connector insert, the method comprising the steps of fabricating a plurality of layers of conductive elastomer as an insert and placing the insert into a connector.

The invention discloses a heap type electronic component and a holding component thereof. The electronic component is arranged on a circuit board and includes a plurality of energy-stored units, each has a first electrode and a second electrode; and the holding component, including a first holding structure and a second holding structure arranged corresponding with the first holding structure. The holding structures have a panel, with two corresponding lateral sides extending and arranged with at least a holding part respectively; at least a guide connection part, in connection with the panel and the circuit board; wherein, at least one holding part of the first and the second holding structures is used to hold and fix the plurality of energy-stored units so that the first and the second electrodes are connected with the panels of the first and the second holding structures respectively. Thereby, the first and the second electrodes of the plurality of energy-stored units are electrically connected with the circuit board via the panels of the first and the second holding structures and at least one guide connection component. The invention can effectively solve the problem of reduced fixation effect caused by welding material fusing in the manufacture process of the heap type electronic component.

In a cooling system for a variable vacuum capacitor, a liquid is arranged inside a cooling reservoir, a first part of the reservoir is designed to absorb heat energy from first bellows of the variable vacuum capacitor, the first bellows being responsible for transporting electrical energy to a second electrode of the variable vacuum capacitor, a second part of the reservoir is designed to dissipate heat energy towards a cooling circuit, and heat pipes are arranged between the first part of the reservoir and the second part of the reservoir.