30results about "Fixed capacitor details" patented technology

The invention relates to the technical field of capacitor films, and discloses a modified polypropylene base film for a capacitor and a preparation method of the modified polypropylene base film. The modified polypropylene base film for the capacitor is prepared from the following raw materials in parts by weight: 90 to 110 parts of polypropylene, 20 to 30 parts of hyperbranched organic silicon, 10 to 15 parts of a composite modifier, 3 to 5 parts of a compatilizer, 0.3 to 0.6 part of an antioxidant and 0.5 to 1.5 parts of a lubricant, according to the base film, polypropylene is used as a main raw material, hyperbranched organic silicon, a composite modifier, a compatilizer and other auxiliaries are added for modification, the polypropylene base film is endowed with excellent breakdown resistance, dielectric property and high temperature resistance, and the base film has wide application prospects in capacitors.

The invention relates to a multi-dimensional metal-insulator-metal capacitor. Embodiments described herein relate to various structures, integrated assemblies, and memory devices. In some embodiments, an integrated assembly includes a device region. The device region includes a capacitor structure including a horizontally disposed first conductive helical structure and a horizontally disposed second conductive helical structure. In some embodiments, the second conductive helical structure is interleaved with the first conductive helical structure.

The utility model discloses a low noise capacitor, and specifically relates to the power capacitor technology field, comprising a capacitor housing, the left and right side walls of the capacitor housing are welded with connecting frames, the two connecting frames are internally provided with filter frames, the filter frames are connected with filter screens, the filter frames are symmetrically welded with two spacing seats, and the spacing seats are arranged on the two spacing seats. A connecting seat is welded on the surface of the capacitor shell, a sliding seat is movably arranged on the surface of the connecting seat in a penetrating mode, one end of the sliding seat is connected with a socket connected with the limiting seat in an inserted mode, and an extrusion spring is connected between the connecting seat and the sliding seat; through the arrangement of the structure, limiting mounting or dismounting cleaning of the filter frame and the filter screen can be rapidly and conveniently achieved, and the practicability of the device is improved.

Methods and apparatuses for use in tuning reactance are described. Open loop and closed loop control for tuning of reactances are also described. Tunable inductors and / or tunable capacitors may be used in filters, resonant circuits, matching networks, and phase shifters. Ability to control inductance and / or capacitance in a circuit leads to flexibility in operation of the circuit, since the circuit may be tuned to operate under a range of different operating frequencies.

The objective of the present invention is to provide a low-power instrument transformer having a temperature compensation function, in which a circuit whose output is adjusted according to a temperature is added to the inside of a signal converter without additionally implementing the temperature compensation function in a merge unit. The low-power instrument transformer having a temperature compensation function, according to one embodiment of the present invention, may comprise: a detection unit for detecting a voltage of an object to be measured; and a temperature compensation unit for compensating for a change, according to temperature, in voltage information measured by the detection unit, and outputting same to the merge unit.

For a capacitor (1), in particular an intermediate circuit capacitor for a multiphase system, comprising a first surface electrode (11) and a second surface electrode (12) opposite it at a first distance (d1), and comprising at least one capacitor structure (20) having at least one dielectric arranged between the first surface electrode (11) and the second surface electrode (12), wherein a conductor surface section (13) adjoins the first surface electrode (11), which is angled at an edge (11a) of the first surface electrode (11) in the direction of the second surface electrode (12) and at least partially covers a first side wall (21) of the capacitor structure (20),with at least one first terminal (31) for electrically contacting the first surface electrode (11) and with a second terminal (32) parallel to the first terminal (31) and separated by a second gap (d2) for electrically contacting the second surface electrode (12), wherein the first terminal (31) projects outwards at an end of the conductor surface section (13) that is directed away from the first surface electrode (11), it is proposed that the capacitor (1) has at least one electrically conductive shielding element (14) fixed to the capacitor (1), wherein the electrically conductive shielding element (14) covers a second side wall (22) of the capacitor structure (20) perpendicular to the first surface electrode (11) and the second surface electrode (12) and to the conductor surface section (13).

The utility model provides an explosion-proof metallized film, a conductive grid in a first conductive grid area and a conductive grid in a second conductive grid area are electrically connected with a grid edge part, and the grid edge part, the conductive grid in the first conductive grid area and the conductive grid in the second conductive grid area are all made of metallized filaments. A fuse is arranged at the joint of each grid in the first conductive grid area and the grid edge part, a fuse is also arranged at the joint of each grid in the second conductive grid area, and when the current value of the capacitor is normal, the first conductive grid area and the second conductive grid area are communicated with each other; when the current value of the capacitor reaches a specific threshold value, the fuses at all positions are fused due to self-heating, so that the polar plate units where the breakdown points are located are integrally isolated from the polar plates of the capacitor, large inrush current is effectively prevented from entering the breakdown points, the problems of multi-layer medium continuous breakdown and large-area burn possibly caused by continuous self-healing breakdown are avoided, and the service life of the capacitor is prolonged. And the safety of the capacitor in the self-healing process is ensured.

The application discloses a reactive macromolecular dielectric reinforcing agent, a polypropylene composite material and preparation and application thereof. The application prepares an activated macromolecular dielectric reinforcing agent through a free radical polymerization reaction of an acrylamide type polar monomer, wherein 1,3-butadiene is used for end capping; then, the activated macromolecular dielectric reinforcing agent is reacted with ethylene to obtain a reactive macromolecular dielectric reinforcing agent. The application also adds the reactive macromolecular dielectric reinforcing agent into a polypropylene polymerization reaction to prepare a polypropylene composite material with a high dielectric constant through coordination polymerization. The application macromolecularizes an amide group, can obviously improve the compatibility of a polar group amide group and non-polar polypropylene, solves the problems of precipitation, dispersion and uneven dispersion of the polar group amide group in a polypropylene matrix, endows the polypropylene composite material with the characteristics of high efficiency and durability of dielectric properties, and is suitable for being used in related products, such as thin film capacitors and lithium battery separators, which need a high dielectric constant.

The utility model discloses a metallized film capacitor with a dustproof structure, which comprises a capacitor inner shell, a capacitor outer shell is arranged outside the capacitor inner shell, and the center line of the capacitor outer shell and the center line of the capacitor inner shell are on the same vertical plane. One side of the capacitor inner shell is provided with a dismounting structure used for rapid dismounting. According to the metallized film capacitor with the dustproof structure, the threaded part is arranged, when the metallized film capacitor needs to be disassembled and assembled, the threaded lantern ring is rotated to be separated from the outside of the threaded part, then the threaded lantern ring is disassembled from the outside of the positioning disc, and then the positioning disc can be disassembled from one side of the inner shell of the capacitor, so that the inner core of the capacitor can be disassembled conveniently; after inspection is completed, one side of the inner shell of the capacitor is covered with the positioning disc, then the threaded part is sleeved with the threaded lantern ring, the threaded lantern ring is screwed tightly, the positioning pressing ring is attached to one side of the positioning disc, and therefore the positioning disc is positioned through the positioning pressing ring, and the problem that rapid disassembly and assembly cannot be achieved is solved.

The invention discloses a release film for a multilayer ceramic capacitor and a preparation method of the release film in the field of polymer composites.The release film is characterized in that polyethylene glycol terephthalate is adopted as a matrix, and specific spherical silicon dioxide and aluminum oxide are matched to form a bimodal nanoparticle system; and a bifunctional modifier containing perfluoroalkyl and siloxane and a hyperbranched multi-arm block polyester siloxane synergistic interface regulating agent are innovatively introduced. The preparation method comprises the key steps of nano particle surface modification, functional master batch melt blending extrusion, two-way stretching forming and the like. Through the synergistic effect of the two special modifiers, the dispersity of nanoparticles in a matrix is remarkably improved, and the interface bonding strength is enhanced, so that the obtained release film has extremely low surface roughness, excellent anti-bonding performance and good heat resistance and dimensional stability at the same time, and completely meets the requirements of a high-end multilayer ceramic capacitor preparation process.

The invention belongs to the field of capacitors, particularly relates to a hierarchical capacitor device, and aims to solve the existing fixing problem, the hierarchical capacitor device comprises a fixing frame, a plurality of fixing plates are mounted in the fixing frame, capacitors are mounted at the tops of the fixing plates, fixing holes are formed in the tops of the fixing plates, and fixing rods are slidably mounted in the fixing holes; one end of the fixing rod extends to the upper part of the fixing plate, the other end of the fixing rod extends to the lower part of the fixing plate, the end, extending to the upper part of the fixing plate, of the fixing rod is fixedly connected with the bottom of the capacitor, storage grooves are formed in the two sides of the fixing plate, telescopic rods are slidably mounted in the storage grooves, and one ends of the telescopic rods extend into the storage grooves. And the other end of the telescopic rod extends out of the storage groove. According to the invention, the capacitor is fixedly connected with the fixing frame through the fixing rod and the fixing plate, so that the use of screws for fixing is avoided, and the capacitor can work and be used for a long time.

The utility model provides an insulating isolation cylinder and a film capacitor with the same, the insulating isolation cylinder comprises a cylinder body, the cylinder body comprises a bottom wall part and a side wall part, the side wall part is annular and is arranged around the bottom wall part, a core bag accommodating cavity is formed between the bottom wall part and the side wall part, the side wall part is provided with a through diversion hole, and a distance is formed between the diversion hole and the bottom wall part. According to the insulation isolation cylinder and the film capacitor with the insulation isolation cylinder, the through diversion hole is formed in the side wall part of the insulation isolation cylinder, the gap is formed between the diversion hole and the bottom wall part, and the gap between the insulation isolation cylinder and the core package can be communicated with the gap between the shell and the insulation isolation cylinder through the diversion hole; in the glue filling process, glue liquid can flow on the inner side and the outer side of the insulation isolation cylinder through the flow guide holes, the flowing path of the glue liquid is increased, and the glue filling efficiency of the thin film capacitor is improved.

The invention relates to the technical field of capacitor films, in particular to a capacitor film for high-temperature application and a preparation method thereof.The preparation method comprises the steps that modified polyimide resin, modified montmorillonite nanosheets, a cross-linking agent and an antioxidant are dispersed in N, N-dimethylacetamide, and mixed slurry is obtained after high-temperature stirring; and carrying out film casting, hot-pressing crosslinking and stripping stretching treatment on the mixed slurry to prepare the capacitor film for high-temperature application. A small amount of trifluoromethyl is introduced into a molecular chain of polyimide, and the trifluoromethyl group has strong electronegativity and chemical stability, so that the breakdown and dielectric properties of a capacitor film and the heat resistance of the film can be improved; the broadband-gap high-insulation montmorillonite nanosheet is adopted as a core, aluminum nitrate is reduced into metal aluminum particles through the dopamine polymer middle layer, the metal aluminum particles are loaded on the metal aluminum particles, and the dielectric property, the breakdown strength and the high-temperature energy storage performance of the capacitor film are improved.

The utility model discloses a thin-film capacitor and electrical equipment, and belongs to the field of thin-film capacitors. The thin-film capacitor comprises a heat dissipation plate, the heat dissipation plate is arranged outside the thin-film capacitor, the heat dissipation plate is composed of heat dissipation areas and a communication structure, and each heat dissipation area corresponds to one heating point of the thin-film capacitor, so that the heat dissipation effect of the thin-film capacitor is guaranteed, the area of the heat dissipation plate is reduced, the thin-film capacitor does not need to be completely covered by the heat dissipation plate, and the heat dissipation efficiency is improved. And materials are greatly saved. Every two adjacent heat dissipation areas are connected through one communicating structure, the communicating structures are arranged to connect the two heat dissipation areas, the two heat dissipation areas can be integrally formed during production, and production is facilitated; and meanwhile, the communication structure can conduct heat between the heat dissipation areas, heat dissipation is assisted, and the heat dissipation effect is enhanced. The width of the heat dissipation area is larger than that of the communication structure, so that the material consumption of the communication structure can be reduced, and the material is further saved.

The invention relates to an electronic device with a reduced electric field in a superficial layer and a method of manufacturing the same. A galvanic isolation device includes a metal cap layer extending over a top metal layer of a galvanic isolation module. The metal cap layer is in electrical contact with the top metal layer at a central portion of the top metal layer. The buffer layer separates the metal cap layer from the top metal layer at a peripheral portion of the top metal layer. Electric field peaks at the edges of the metal cap layer and the top metal layer are decoupled from each other by recessing side edges of the metal cap layer a distance (e.g., greater than 1 micron) from corresponding edges of the top metal layer.

This invention discloses a multi-chip parallel orthogonal current sharing module and its fabrication method. The module provides a first chip layer where the lower power semiconductor devices are arranged in a planar symmetrical layout, and the vertical positions of each lower power semiconductor device correspond to the corresponding upper power semiconductor device. Due to the vertical position correspondence combined with the planar symmetrical layout, the inductance of each path within the first and second chip layers is consistent, thus easily achieving a better current sharing effect. Furthermore, the metal pads connected to the lower part of the decoupling capacitor, which are set in the copper plate holes at the AC end, are arranged parallel to each lower metal pad. This allows the decoupling capacitor to have reverse mutual inductance with each lower power semiconductor device. The upper metal pads of the capacitor are also arranged parallel to the upper metal pads of the capacitor, thereby achieving reverse mutual inductance between the decoupling capacitor and each upper power semiconductor device. This, in turn, cancels out the vertical path mutual inductance, achieving the goal of reducing parasitic inductance.

The invention discloses a metallized film capacitor and a household electrical appliance, and the metallized film capacitor comprises a capacitor core which is formed by winding a dielectric material of a metallized polypropylene film, and the thickness of the metallized polypropylene film is 5.8 [mu] m; the capacitor core adopts a mixed filling medium formed by mixing polyolefin oil and quartz sand in the impregnation process, and the mixed filling medium permeates between thin film layers of the capacitor core. The capacitor core is formed by winding a dielectric material of a metallized polypropylene film with the thickness of 5.8 microns, the material cost can be greatly saved, meanwhile, the metallized film capacitor can be miniaturized and lightened, and the capacitor core adopts a mixed filling medium formed by mixing polyolefin oil and quartz sand in the impregnation process, so that the metallized film capacitor is more compact and lighter, and the service life of the capacitor core is prolonged. Good heat dissipation performance of the metallized film capacitor can be well guaranteed, and the use performance of the metallized film capacitor is guaranteed.

Embodiments described herein relate to various structures, integrated assemblies, and memory devices. In some embodiments, an integrated assembly includes a device region. The device region includes a capacitor structure that includes a first conductive spiral structure that is horizontally disposed and a second conductive spiral structure that is horizontally disposed. In some embodiments, the second conductive spiral structure interleaves with the first conductive spiral structure.

The embodiment of the invention provides a capacitor, a circuit board assembly, a chip and electronic equipment, and relates to the technical field of capacitors. The capacitor comprises a substrate, the surface of the substrate is provided with a plurality of cellular areas arranged in an array mode, each cellular area comprises at least three groove arrays, each groove array comprises a plurality of grooves arranged side by side, and the arrangement directions of the grooves of any two groove arrays intersect and do not coincide. Therefore, the stress distribution on the substrate can be improved, and the reliability of the capacitor can be improved.

An electronic component includes a capacitor element, an inductor element connected electrically to the capacitor element, and an interlayer-insulation layer between the capacitor and inductor elements. The interlayer-insulation layer has a first principal surface, a second principal surface, and a via hole through the interlayer-insulation layer between the first and second principal surfaces. The capacitor element is at a side of the second principal surface of the interlayer-insulation layer and includes a first electrode layer, a second electrode layer, and a dielectric layer interposed between the first electrode layer and the second electrode layer. The inductor element is at a side of the first principal surface of the interlayer-insulation layer and includes an inductor wire that has an inductor portion disposed on the first principal surface and also has a via portion through the via hole to connect the inductor portion to the second electrode layer.

A DC support capacitor with state monitoring comprises a DC support capacitor, a DC support capacitor insulator arranged on the DC support capacitor, and at least one monitoring control module arranged on the DC support capacitor insulator. And the monitoring control module comprises an insulating shell, an energy-taking acquisition coil, an energy-taking module, a temperature induction sensor and a control module. The control module and the energy taking module are connected with each other. And the control module controls the starting and stopping of the direct current support capacitor on the basis of collecting the current charging and discharging waveform of the energy-taking collecting coil and the temperature of the temperature induction sensor. The DC support capacitor with state monitoring can monitor the current and temperature rise of the capacitor in real time, grasp and evaluate the self-healing condition in the capacitor, and avoid the occurrence of vicious accidents.

The application provides a capacitor insulator, which comprises a base plate in a cylindrical structure, a through hole is formed in the middle of the base plate and is used for penetrating a terminal post, a flange ring is arranged at the lower end of the outer wall of the base plate, and a plurality of annular grooves are coaxially arranged on the top of the base plate; during assembly, the upper end of the base plate penetrates a top plate of the capacitor, the annular grooves are located above the top plate, and the flange ring is connected to the bottom of the top plate through screws. The scheme has higher installation precision and stability and better insulation performance.

The invention discloses a thin-film capacitor core energizing assembly with an impulse current function, and belongs to the technical field of thin-film capacitor core energizing assemblies. A thin-film capacitor core energizing assembly with an impact current function comprises a rack, a conveying module, a driving module, clamping modules, energizing modules and a voltage and current regulating module, a rotating disc is arranged on the rack in a penetrating mode, the clamping modules and the energizing modules are evenly distributed on the edge of the rotating disc, and the clamping modules are provided with correction mechanisms. The correcting mechanism can conduct accurate grabbing and direction correction according to the conveying position and angle of the core to be energized, it is ensured that the clamping pieces can conduct clamping along the kidney-shaped axial transverse face of the core to be energized, clamping deviation is avoided, the yield of the core to be energized is increased, deviation of the core to be energized during clamping is avoided, and the energizing efficiency is improved.

The invention discloses a multi-chip parallel orthogonal current sharing module and a preparation method thereof, each lower power semiconductor device in a first chip layer provided by the module is in plane symmetry layout, and each lower power semiconductor device corresponds to the upper and lower positions of a corresponding upper power semiconductor device; due to the facts that the upper position corresponds to the lower position and the plane symmetry layout is combined, all path inductances in the first chip layer and the second chip layer are consistent, and a good current sharing effect is easily achieved. A capacitor lower connecting metal cushion block of a decoupling capacitor arranged in an AC end copper plate hole is parallel to each lower metal cushion block, so that the decoupling capacitor and each lower power semiconductor device are reversely and mutually inducted, and a capacitor upper metal cushion block and a capacitor upper connecting metal cushion block are parallel to each other. Therefore, reverse mutual inductance between the decoupling capacitor and each upper power semiconductor device is realized, mutual inductance cancellation of a vertical path is further realized, and the purpose of reducing parasitic inductance is achieved.

The invention discloses a thin film capacitor external structure for a new energy electric vehicle. Comprising a capacitor core. The shell is arranged to be of a rectangular box body structure, heat dissipation fins are arranged on the top of the shell and comprise the first heat dissipation fins and the second heat dissipation fins, a first heat dissipation space is formed between the shell and the first heat dissipation fins, and a second heat dissipation space is formed between the shell and the second heat dissipation fins. A second heat dissipation space is formed between the first heat dissipation fins and the second heat dissipation fins; the installation support is fixed to the outer side of the shell and used for being connected to a vehicle chassis through a damping structure. The problem of how to improve the heat dissipation efficiency and the vibration resistance can be solved.

The application discloses a pulse capacitor adopting a primary and secondary core group, and relates to the technical field of pulse power. The pulse capacitor comprises a primary core control module and at least two secondary core modules. Each secondary core module comprises an energy storage capacitor unit and a switching unit connected in series with the energy storage capacitor unit. A controller of the primary core control module is connected with the control end of the switching unit of each secondary core module through a driving circuit. The primary core control module determines a target control mode in response to a discharge command. The control mode of the primary core control module comprises: an independent gating discharge mode, in which at least one secondary core module is selected based on a trigger instruction, and the energy of the secondary core module is discharged to a device; and a cooperative timing discharge mode, in which a multi-path trigger signal sequence is generated based on a high-level waveform description instruction, each secondary core module is sequentially or overlapped turned on in a specific timing sequence, and the current of the secondary core module is superimposed on the device to obtain a composite pulse. The problems of single capacitor discharge mode, low system reliability and large current impact on service life are solved.

The invention discloses a pulse capacitor adopting a child-mother core group, and relates to the technical field of pulse power, the pulse capacitor comprises a mother core control module and at least two child core modules, each child core module comprises an energy storage capacitor unit and a switch unit connected in series with the energy storage capacitor unit; the controller of the mother core control module is connected with the control end of the switch unit of each sub-core module through a driving circuit; the mother core control module responds to the discharge command and determines a target control mode; the control mode of the mother core control module comprises: an independent gating discharge mode: selecting at least one sub-core module based on a trigger instruction, and discharging energy of the sub-core module to equipment; according to the cooperative time sequence discharge mode, multiple trigger signal sequences are generated based on an advanced waveform description instruction, the sub-core modules are conducted in sequence or in an overlapped mode according to a specific time sequence, currents of the sub-core modules are overlapped on equipment to obtain composite pulses, and the problems that the capacitor discharge mode is single, the system reliability is low, and the service life is affected by large current impact are solved.

The utility model belongs to the technical field of atomic layer deposition, and relates to an electrostatic powder coaxial capacitor, which comprises an outer cylinder used for accommodating an inner cylinder; the inner column body is used for forming an electric field together with the outer column body; the inner column body is arranged in the outer column body; the insulating part is used for insulating the outer column body and the inner column body; the insulating part is respectively connected with the outer column body and the inner column body; wherein the outer column body is connected with a negative electrode of a power supply, and the inner column body is connected with a positive electrode of the power supply. According to the electrostatic powder coaxial capacitor provided by the invention, the dispersion uniformity of powder in an atomic layer deposition process is improved, so that the quality of a thin film is improved; the powder agglomeration phenomenon is reduced, and equipment blockage and operation interruption caused by agglomeration are avoided; through electrostatic auxiliary dispersion, the working efficiency and stability of the powder ALD equipment are improved; the technology can be expanded to other industrial fields needing powder dispersion, and has a wide application prospect.

The utility model relates to the technical field of film capacitors, and provides a high-stability film capacitor for medical imaging equipment, which comprises a base, a shell fixedly mounted on the base, and a ventilation device mounted on the base and used for reducing the temperature of the capacitor. The motor is started to drive the fixing rod at the output end of the motor to rotate, the fixing rod rotates to drive the fan to rotate, heat on a capacitor core enters through the ventilation opening in the rotating cylinder and is discharged out of the ventilation groove under the action of the ventilation groove and the ventilation pipeline, and the outer gear ring drives the rotating cylinder to rotate under the action of the connecting device. Therefore, the contact range of the ventilation opening in the shell is wider, the ventilation effect is better, and the condition that the capacitor is thermally damaged due to heating and temperature rise when the film capacitor works for a long time is avoided.

Devices and methods for improving voltage handling and / or bi-directionality of stacks of elements when connected between terminals are described. Such devices and method include use of symmetrical compensation capacitances, symmetrical series capacitors, or symmetrical sizing of the elements of the stack.