Cutting device

Abstract

The invention provides a cutting device which can constitute, in loadable and unloadable manners, a shielding component for shielding a lens of an imaging unit, and can take off the shielding component for replacement and cleaning in a case that the shielding component is contaminated. The cutting device includes a chuck worktable for holding a processed article; the imaging unit with the lens for detecting a to-be-processed region of the processed article held on the chuck worktable; and a cutting unit which cuts the processed article held on the chuck table and comprises: a cover component that is mounted at a lower end of a lens housing in such a manner of surrounding the lens housing for receiving the lens in the imaging unit and that includes an imaging opening for taking the image to the lens; and a shielding unit that is mounted on the imaging opening of the cover component in the loadable and unloadable manners, a circumferential section of the transparent plate is held on an annular frame body and used for shielding the lens.

Description

technical field [0001] The present invention relates to a cutting device for cutting workpieces such as semiconductor wafers. Background technique [0002] For example, in a semiconductor device manufacturing process, ICs are formed in a plurality of regions divided by planned division lines called streets (streets) formed in a lattice shape on the surface of a substantially disc-shaped semiconductor wafer ( Circuits such as Integrated Circuit (Integrated Circuit) and LSI (Large Scale Integration: Large Scale Integration) are manufactured by dividing each region in which the circuit is formed along the planned division line, thereby manufacturing individual semiconductor chips. Generally, a cutting device, which is a dicing device, is used as a dividing device for dividing a semiconductor wafer. The cutting device includes: a chuck table for holding the workpiece; an imaging unit for detecting the region to be cut of the workpiece held on the chuck table; A cutting unit fo...

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that when the chuck table holding the workpiece is moved to the cutting area and the cutting operation is performed by the cutting unit, the spray of cutting water containing cutting chips adheres to the imaging unit and contaminates the imaging unit. objective lens

[0006] The shielding unit that shields the below of the objective lens housing that accommodates the objective lens of the above-mentioned camera unit includes: a guide member, which is installed at the lower end of the objective lens housing at right angles to the optical axis of the objective lens, and has the first hole corresponding to the objective lens housing; A part, which is movably arranged on the lower side of the guide part, is composed of a flexible sheet member having a second hole corresponding to the first hole; and an action unit, which makes the shielding part move along the lower surface of the guide part Move to position it at the active position where the second hole is opposed to the first hole and the shielding position that shields the first hole. Such a shielding unit has the following problem: cutting chips including cutting chips are attached to the guide member and the shielding member. water, thereby hindering the action of the shielding parts

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